Electronics Forum | Wed Apr 21 18:58:44 EDT 1999 | Earl Moon
| Technically speaking, there is nothing for me to say. Oh maybe just one thing - to get me back into the fray: Steve, I must say I totally disagree with your assessment of under screen cleaners. I have had nothing but excellent results using the dr
Electronics Forum | Thu Jun 03 07:10:31 EDT 1999 | Earl Moon
| | To you all for comment and summary, | | | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | | | 1) A good set of design rules | | 2) A good set of design rules
Electronics Forum | Wed Apr 21 13:52:34 EDT 1999 | Steve Gregory
Technically speaking, there is nothing for me to say. Oh maybe just one thing - to get me back into the fray: Steve, I must say I totally disagree with your assessment of under screen cleaners. I have had nothing but excellent results using the dry,
Electronics Forum | Wed Jun 02 15:05:59 EDT 1999 | JohnW
| To you all for comment and summary, | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | 1) A good set of design rules | 2) A good set of design rules meeting pro
Electronics Forum | Thu May 11 04:23:50 EDT 2000 | Earl Moon
Hey folks, I'm on your side, as I said many times in this string. To end it, from my point of view, I will offer the following diatribe with which I responded to one of you whom I respect very much - Dave F. This is my last say on the subject and I
Electronics Forum | Tue Jul 20 19:09:25 EDT 1999 | JohnW
| | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk pas
Electronics Forum | Wed Jul 21 10:05:22 EDT 1999 | Mark Quealy
| | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk p
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Wed Jul 21 11:49:24 EDT 1999 | Deon Nungaray
| | | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk
