Electronics Forum | Wed Apr 04 13:33:12 EDT 2012 | rway
We currently have 2 M1 systems. Our false call rate has never been has high as you suggest. There is something wrong with your program and/or inspection algorithms, as you probably already know. You should be somewhere between 1000-1500 vcpmo (fal
Electronics Forum | Tue Jul 18 06:59:02 EDT 2017 | cyber_wolf
Sergey, I understand your thought process kinda, but you are not going to justify yourself a pick and place line based on a "simple" 5K board contract unless you know something we don't. You do not want a machine that has buggy or slow software. Any
Electronics Forum | Mon Mar 30 11:02:37 EDT 2020 | SMTA-Eric
As we navigate through the CORVID-19 pandemic, many essential manufacturing facilities are still on line and operating. Some at reduced or modified schedules in following the guidelines to help reduce the spread of this virus. My question is in rega
Electronics Forum | Wed May 20 16:07:22 EDT 2020 | stephendo
You want a big enough storage tank to smooth pressure. Figure out what size pipes you need and go a size bigger. Make a loop of the pipes with shut offs. That way you can shut down any section and still have air to the rest of the air line. Run the p
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Tue Jul 17 21:48:09 EDT 2007 | davef
Per ESD Handbook TR 20.20 paragraph 5.3.15 Humidity "Humidity is beneficial in all ESD Control Program Plans. Contact and separation of dry materials generates greater electrostatic charges than moist materials because moisture provides conductivity
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Tue Apr 09 16:25:28 EDT 2002 | clarkk
Alan, You're right, mass inspection after assembly won't work. The inspectors will miss 25% (or more) of the defects, and the boards will be reworked before SMT operators can properly define defects and their sources. The company I work for tends to
Electronics Forum | Mon Jun 27 14:20:57 EDT 2005 | Bob R.
If you visually inspect the solder joints of the first dozen or so boards with the Pb free parts and you're meeting workmanship standards then I wouldn't worry about it. When we started getting the first barrage of Pb free parts a couple years ago w
Electronics Forum | Sun Nov 08 15:27:25 EST 2015 | davef
Thinner: Flux thinner, NOT paint thinner We kept a spare stone in thinner in inventory. We cut PVC pipe to size, cap in one end, screw thread on the other, stone inside, filled with flux thinner and covered with a screw cap. I don't remember who we
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