Electronics Forum | Thu Jan 20 17:14:39 EST 2005 | jbrower
Today, I have just finished evaluating Kester's EM907 (SAC305)lead free solder paste and found that for our applications it performs as expected. End result that I am encouraged with the results that we got. The equipment that I used: An SMT2020 to
Career Center | Danville, California | Sales/Marketing
Robert Riemer 129 Wilshire Ct. Danville, CA. 94526 (925) 820-6545 Home (925) 820-6546 Fax (925) 548-9633 Cell briemer@pacbell.net OBJECTIVE Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in the electro
Electronics Forum | Fri Aug 10 13:52:58 EDT 2001 | davef
When you say that glue viscosity changes for lot to lot, is this LOT TO LOT of your product OR Loctite�s product? And when you say that glue viscosity changes, what do you mean [eg, increase by � , decrease by � , er watt?]. What specifically is th
Electronics Forum | Tue Nov 01 15:26:43 EST 2005 | GS
Is it this your first experience of C-CGA RWK ? In order to approach a RWK of this kind of pakage it requires a capable process and clear operating procedure. In the past, the company who I use to work for, we rwkd plenty of this kind of CCGA. Earl
Career Center | Danville, California USA | Sales/Marketing
Seeking a challenging sales position with a dynamic company pursuing rapid, consistent growth in technology design, equipment or related industry. Summary: Seasoned professional with a broad-based sales background including regional management, dire
Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis
| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple
Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach
| We are about to run our first BGA devices and would appreciate some confirmation on a few points. | First some details: | PCB & Device: | ============= | 1) 16 layer (4 power, 4 gnd, 8 signal) | 2) gold on nickel finish | 3) ceramic BGA with eutec
Electronics Forum | Thu May 26 16:41:00 EDT 2011 | scottp
Here's what I do: - Test Surface Insulation Resistance (we're in the high reliability market and use a test significantly harder than IPC's). I also test SIR in combination with other assembly materials like conformal coatings and wave solder flux
Electronics Forum | Fri Sep 10 11:45:09 EDT 1999 | Scott S. Snider
| scott. | I appreciate your sincere answer. | would tell me the hint about printer if i's possible | To tune our smt process we have to know what is the major X's | for defect. To know major X's with DOE we need a good measurement equipment.
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