Electronics Forum | Fri Feb 27 11:33:32 EST 2004 | Bryan
Very strange question,but interesting.Is there anyone who have conducted any experiments to figure out the results?I made a profile board,one thermal couple on pad and other one drilled into the ball of BGA.the 2 points are perpendicular to conveyor
Electronics Forum | Wed Feb 10 05:23:17 EST 2021 | karl_willoughby
Hello. I am sourcing machines for an SMT line (for the first time) and would like to understand features of current and earlier model SPI and AOI machines. In the intended application, a high volume of PCAs aren't required to be processed but there
Electronics Forum | Tue Feb 17 04:52:13 EST 2004 | John W
There's normally a number of reasons people want to know what melts 1st, 1 - to see if you know, 2 voiding issues - whole can of worms 3 device alignment. One of our collegues has said that most balls are Eutectic, that's in fact not totally correct.
Electronics Forum | Fri May 15 21:39:48 EDT 2015 | jlawson
Reflow.. 1.Rehm (Germany) - Best in Class Best overall process stability heating system ( Alot of makers have started to copy there VX heating arrangement ). COnveyor chains can be a bit more attention in terms of maintenance on rehm , but if foll
Electronics Forum | Tue Aug 22 16:02:07 EDT 2000 | Dr. Ning-Cheng Lee
If the thermal mass of the products is small, a tent-shaped profile is recommended, with peak temperature around 240C. The hottest spot on board should be less than 250C. However, if the thermal mass of the product is large, such as a large server PC
Electronics Forum | Thu Sep 27 16:40:12 EDT 2012 | davef
Ideally, shelf life should be twelve months from application, but not all OSP's are the same so check manufacturer's instructions
Electronics Forum | Thu Aug 31 21:15:46 EDT 2000 | Dave F
From the SMTnet Library try: http://www.merix.com/resourcecntr/papers/osp.doc http://www.merix.com/resourcecntr/papers/hasl_alt.doc http://www.itm-smt.com/articles.html * "Organic Solderability Preservatives" * "OSPs - Better Living Through Modern Ch
Electronics Forum | Thu Sep 27 09:53:46 EDT 2012 | testbloke
Anyone ?
Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.
Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va
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