Siemens Siplace X4 Pick And Place Machine Siemens Siplace Pick And Place Machine Siemens Pick And Place Machine Siemens Pick and Place Machine Patch speed:120000CPH Dimension:1900×2734 Weight: 3460kg Product description: Siemens Siplac
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Fri Sep 26 01:15:05 EDT 2008 | scauter
Can anyone take a look on the cross sectional diagram of this reflowed BGA ball? Any idea on what has happened to this? The PCB surface finsihing is OSP with regular lead-free 305/405 solder paste. Thanks SC
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Tue Oct 15 20:33:43 EDT 2002 | davef
First, this is a very interesting question. Second, there is no specification. Third, companies develop guidelines for rework based on their expectations for their product reliability. Things to consider are: * Motorola allows no product shipments
Electronics Forum | Sun Apr 11 11:39:52 EDT 2010 | manchella
When we have sent some of motherboards for reliability testing in a tird party laoratory. It is found that when Dye&Pry is done after 600 cycles of Thermal Cycling, in LGA socket only one of the corner solder joing had 100% type 3 crack. All other so
Electronics Forum | Mon Oct 27 23:25:56 EDT 2008 | davef
Each thermal cycle decreases the thickness of the OSP. So depending on the material, fabrication method, and blablabla; after one thermal cycle we'd expect the OSP to provide adequate protection for a couple of days. After that, you may need a more a
Electronics Forum | Thu Aug 29 20:15:26 EDT 2002 | davef
That you are getting BIG gobs of solder on the pads indicates that your print / paste process is probably OK. Sounds like someone did something bad to the OSP. Tell us about: * Supplier and brand of OSP that your board fabricator used. * Number of
Electronics Forum | Sun Jan 28 13:26:27 EST 2007 | Sweet Old Bob
Okay you CM haters I don't see anything about the design of the board, other than OSP which is strike one. What is the board size? What is the board thickness? Where is the BGA located on the board? What is your ball to pad ratio? What is your aspect
