Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Tue Jan 23 10:22:27 EST 2007 | Peter W.
Hello, maybe you are experiencing the so called "head in pillow" defect. It is especially critical for larger BGA. The defect comes from the deformation during reflow of the BGA, so that some of the balls are lifted and have no contact during liquid
Electronics Forum | Thu Jul 05 19:39:19 EDT 2001 | davef
I had forgotten that it was you that was on the Sipad adventure. [But then again, who can keep track of yer aliases? ;-)] You just go from one adventure to the next. Expanding On Dave�s Hi-Test Flux Method Theory � PASTE: Yes, contact your favorit
Electronics Forum | Thu Jun 28 09:07:51 EDT 2007 | mika
Laser cut 0.13mm stencil thicknes works great for us. BTW, are we talking RoHS solder paste? We do reduce the stencil apertures to 88 % of the pads when we go for the RoHS solder paste. Otherwise we go fo 96% reduction in general with some excemption
Electronics Forum | Thu Dec 03 21:40:01 EST 2020 | itmconsulting
Hey Kyle - Good for you for pushing your horizons and considering pin-in-paste (aka "Intrusive Soldering"). Don't let the nay-sayers out there discourage you. When I encounter mixed tech PCBAs (SMT and through-hole) my first choice, if the design a
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Thu Jul 29 11:34:27 EDT 1999 | Justin Medernach
| | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | 12BGA per assembly | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | Pads .014inch | | | | | | Vias within footprint .020inch | | |
Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon
| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02
Electronics Forum | Sun Apr 25 18:25:10 EDT 1999 | Steve Gregory
Hey Guys! Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... Whoever laid this out, I'd like to go and do a "Back to t
Electronics Forum | Sun Apr 25 20:24:03 EDT 1999 | Bubba
| Hey Guys! | | Look what I get to try and do this week! I got handed a cardboard box on Friday afternoon with the parts and 20 of these little jewels! That's both sides of the board by the way... | | Whoever laid this out, I'd like to go and do a