Electronics Forum: overprint and solder and stencil (Page 9 of 15)

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Fri Apr 23 15:04:44 EDT 1999 | M.T.

| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t

Re: Bottom side smt and thru hole

Electronics Forum | Wed May 27 10:19:43 EDT 1998 | Jerry

We have no problems but orientation does matter. Orient with longest side of component body perpendicuar to wave. In other words the same preference as with through hole DIPS. Idea is the same as for through hole, that the surface tension will ten

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef

I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Thu Mar 05 11:53:09 EST 2009 | dcell_1t

Hello to all. for certain time, we have been struggling with some issues on a PCB where have tombstoning on 0402 components (due to pad design) and dewetting in qfp256 0.5 mil pitch (discussed on another threads on this forum) component, we have pro

Solder beads on small caps and res.

Electronics Forum | Wed Dec 06 16:48:42 EST 2006 | Mario Scalzo

I would be glad to help you eliminate the solder balling and beading that you are seeing. As this is a fairly common defect, I would like to forward you an Application Note that we have developed that explains the cause and possible solutions. Most

Conductive contamination and the elusive solution

Electronics Forum | Fri Jul 13 16:45:37 EDT 2007 | losersk8er

The Contamination has proven to be pretty random, lots of stainless steel though in fact two cases in the past two days. As far as I know all machinery is cleaned regularly as well, even the stencil washer itself. The boards we make are 90% (at l

0402 tombstoning and dewetting on QFP256 trade-off

Electronics Forum | Fri Mar 06 10:46:35 EST 2009 | davef

First, we agree with Loco that your QFP is nonwetting, rather than dewetting. Your sceen-shots look like ol' timey SnPb paste recipes. Turn-up the heaterometer dial. Second, on nitrogen: * We kinda think your O2 needs to be around 100ppm with 99.99%

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Fri Apr 23 15:33:50 EDT 1999 | C.K.

| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory

Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or


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