Electronics Forum | Tue Sep 08 15:11:26 EDT 1998 | Mike Demos
Rich: In my experience, I have seen three cases of SMT Capacitors cracking: 1. Due to thermal shock when entering the wave solder. Note that these were 1210 package sizes on the wave solder side of the boards. We were able to trace this back to th
Electronics Forum | Tue Aug 09 10:46:43 EDT 2016 | emeto
this really depends on the pad sizes. You can see 15 different pad sizes for the same component package. Take a look in IPC 7525. I am attaching an article as well, so you can get an idea.
Electronics Forum | Fri Apr 06 09:45:08 EDT 2007 | pjc
CSP= Chip Scale Package, meaning small. A MicoBGA is a CSP, while a regular BGA is not a CSP. CSPs require fewer steps to fabricate than standard BGAs. A commonly quoted definition of a CSP is a package where the body size is
Electronics Forum | Thu Mar 26 13:31:37 EDT 2020 | rgduval
As everyone else said, if you don't have CAD, it's a pain to digitize the gerbers. So much so that we only did it once when I went to CircuitCam training. After you digitize the gerbers, you have to merge the BOM with it. And you have to tell it p
Electronics Forum | Tue Apr 12 20:35:30 EDT 2005 | Thaqalain
What these stands for: 0603 and 0402 component package, is there any standard or chart to know what these numbers referred to/corresponding sizes?Please include other packages and paste complete chart/table with reference standard.
Electronics Forum | Wed Sep 13 11:23:37 EDT 2006 | teamcanada
Is there any published info on acceptable losses in SMT assembly. Especially for small to medium sized production runs with switch overs several times weekly Different losses for component sizes and packaging? Thx Vaughn
Electronics Forum | Wed Nov 27 08:08:08 EST 2019 | dontfeedphils
Just make more specific shapes/packages for these size parts and decide on a naming convention that's easy to decipher then stick with it.
Electronics Forum | Mon Feb 25 21:09:48 EST 2002 | davef
You are correct about a TCE [CTE] mismatch issues in ceramic packages. The coefficient of thermal expansion [ppm/�C] of major ceramic package elements are: * Silicon - 3 * Standard 92% alumina ceramic � 6.5 * FR4 board � 18-20 Several points are: *
Electronics Forum | Wed Oct 01 16:53:05 EDT 2003 | johnpatricelli
We use Mydata PNP equipment, and are quite happy with it's speed and accuracy, especially with the latest version of the Mydata Tpsys software which includes a prototype version of their emergent auto-teach function for package sizes that can handle
Electronics Forum | Fri Jun 27 10:04:55 EDT 2003 | Charlie Finke
Does anyone know of a good web site that lists general package dimensions for various SMT device sizes, like 1206, etc.?
