Electronics Forum: packing (Page 9 of 45)

Servo Amplifier Alarm on Fuji CP4-3

Electronics Forum | Thu Nov 04 06:46:19 EDT 2010 | adriana

We find the problem on Servo Pack for F theta axis .The component QM20TD-H Mediu power Switching is damaged! Many thanks!

PCB over shelf life

Electronics Forum | Thu Dec 16 23:17:02 EST 2010 | Jacki

Hi Kim Dun take any risk in delamination bcoz u will be the person to answer for being it. So, we do bake all Pcbs, which have 3months of shelf life, b4 startin any process although they are still inside the factory packs.

Why delamination happens on PCBs?

Electronics Forum | Mon Jun 20 02:43:55 EDT 2011 | milroy

What is the correct FR4 for RoHS? This PCB is a 4layer board. When we get the boards from the supplier they are properly packed in vaccum sealed bags without HIC card but there is desicant in side.

Dry Packing Desiccant Source

Electronics Forum | Wed Aug 08 22:04:16 EDT 2012 | davef

I know of no such industry standard. Start with MIL-D-3464E, Desiccants, Activated, Bagged, Packaging Use And Static Dehumidification http://www.wbdg.org/ccb/FEDMIL/d3464e.pdf

Dry Packing Desiccant Source

Electronics Forum | Thu Aug 09 11:04:24 EDT 2012 | joeherz

Thanks, Dave. A little light reading on the Thursday:) I did learn a new word though - nondeliquescent.

OSP PCB Shelf life and part packs

Electronics Forum | Thu Sep 27 16:40:12 EDT 2012 | davef

Ideally, shelf life should be twelve months from application, but not all OSP's are the same so check manufacturer's instructions

Baking BGA on reel

Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef

IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed May 31 07:55:55 EDT 2017 | buckcho

In IPC it is said that the void % should be established between you and the customer. There is no number. There is only requirement for balls on BGA. I have a customer that agreed to 40% on D-packs which is okay for both us and them.

Sulfur in ESD Mat

Electronics Forum | Wed Nov 29 20:57:10 EST 2017 | davef

Jez, you're digging away in the grass on this one. Long time ago. Look at: FED-STD-101, Method 3005 for reducible sulfur. The standard is maintained by some packing material group. Interestingly, it's not uncommon to see it referenced in other elec

CP45 Conveyor direction

Electronics Forum | Tue Jun 11 13:25:22 EDT 2019 | romford_navy

Anyone know how to change direction of placement conveyor on CP45FVNEO? Changed direction in factory mode but no change? Input & Output ok Changed on conveyor pack board

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