Electronics Forum: paste mesh (Page 9 of 13)

Re: Polyimide See Thru Stencils for Printing Solder Paste

Electronics Forum | Tue Jun 23 19:01:21 EDT 1998 | EC

| Has anyone seen/used these yet? They seem to have lower coefficient of friction for release of paste and less wear and tear as well as conforming to the board better (plastic has better memory than stainless). Also there is no mesh so a larger ima

Double-Sided BGA Process

Electronics Forum | Tue Sep 14 13:54:13 EDT 2004 | paul_boxboro

I'm with Chris' approach as a first effort. If you don't have any luck, consider using a high (reflow)temp solder paste for the first pass reflow, and your standard solder paste for the second pass refow. Years ago I had a similiar challenge with an

Re: Solder FINES vs. Solder Balls

Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea

| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Tue Jun 09 07:35:23 EDT 1998 | Steve Gregory

Hi there Gary, Your solder ball problem is very similar the problem I experienced, but I was using a water soluble paste at the time. It started by inspectors telling me that they were seeing cold solder on some SIMM's that we had built regularly. W

Paste Dispensing

Electronics Forum | Thu Jan 10 22:55:24 EST 2002 | davef

You are sure taking you sweet time getting this thing running. You're getting too much beach time. NOZZLE SELECTION Typically, the only rule of thumb that applies to choosing the correct nozzle ID is that it should be one half of the required dot d

Solder Spotting on Gold

Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis

This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder

Re: STENCIL CLEANING WITH SOLVENTS

Electronics Forum | Tue Nov 30 23:00:11 EST 1999 | Ricky L. Price

Bill S. is correct on the positive effects of the Smartsonic 440-R SMT detergent. We have been using this in conjunction with a Smartsonic 4200-2D ultrasonic washer that is equipped with a tank heater set at 100'F. Our suggested process window to p

Solder Splatter

Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi

well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread

PoP parts

Electronics Forum | Thu Apr 17 14:01:26 EDT 2014 | hegemon

And digging a bit further, are the opens at the device level (all the solder on PWB pad, none on device pad) or at the PWB (similar to pillow defect?) After answering that, I would start thinking about(in this order)paste print quality and consisten

PCB damage in Water Cleaner

Electronics Forum | Fri Jul 28 11:16:09 EDT 2017 | robertwillis

Yes it happens with any inline cleaner with small or light boards the pressure can cause them to flip. If they lodge in the links they can also cause damage to the conveyor. For small boards, flexibles etc you do need a mesh fixture of some sort or l


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