Electronics Forum | Tue Jul 30 12:27:39 EDT 2013 | jorge_quijano
Hola I have this connector (atached image) for Wave Solder process, there is one pin with no solder on the top, for me it seems that the large trace connected to that pin is "stealing" the heat... I'm not WS expert... can it be corrected by profile?
Electronics Forum | Wed Jan 21 12:25:45 EST 2015 | dyoungquist
Kester makes a thermocouple solder: Alloy SN10PB88AG2 Flux "44" Core 58 Diam 0.031" I have used this to solder thermocouples to pcbs when profiling for lead-free temperatures. When done you can unsolder the thermocouple and reuse it again. This g
Electronics Forum | Mon Apr 12 09:36:57 EDT 2004 | wgaffubar
Russ, These are the pb free components that you mentioned that are coming around the bend. Not the old CBGA's. I use to use CBGA's alot with former company. These are 15 x 15 mm plastic BGA's with 14 mil pg free solder balls going on 8 mil gold pads.
Electronics Forum | Wed Aug 04 18:57:26 EDT 1999 | Dreamsniper
| What oven temperature should be used to reflow solder (Sn63Pb37) on a PC board (0.075" to 0.100" thickness) in 5 to 10 minutes? | Hi Judy, In profiling you need an understanding of the reflow specs from the solder paste manufacturer then you nee
Electronics Forum | Wed Jun 21 07:44:31 EDT 2006 | amol_kane
Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher heat"? Actually depending upon the ratio of solder contributed by the pad (SnPb) to the ratio of the SAC solder contributed by the BGA Ball, the SAC sold
Electronics Forum | Sat Jul 29 09:01:08 EDT 2006 | davef
Well, a "reflothermal recipe" is a typo. It should read "reflow thermal recipe". Sorry for the confusion. Most people call this THE PROFILE. We think a profile is the output of a profiler when it portrays the result of a reflow recipe. We're gue
Electronics Forum | Wed Apr 30 12:26:10 EDT 2008 | dphilbrick
There must be discussions about this on SMTnet but I have yet to find them. I would like to hear from all you smart people about running LF and PB BGA�s on the same board using 63/37 solder. If you run your profile up to peak at around 225C +/- (nitr
Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef
I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does
Electronics Forum | Wed Jun 14 17:17:53 EDT 2006 | SMTRookie
I'm looking for a No Clean low or an ultra low flux residue solderpaste (SAC305 and Sn/Pb). Any Recommendation? Is there something in the datasheet that will tell if a solder paste is really a low residues flux. Also is there a method to clean the
Electronics Forum | Fri Feb 03 17:25:47 EST 2012 | tombstonesmt
We've been having issues with our current process of oven profiles. We use a high temp adhesive to bond the thermal couples to the desired components. The issue of them letting go or releasing during reflow temps are hit or miss. Majority of our buis
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