Electronics Forum | Tue May 21 16:48:29 EDT 2019 | Matt
Hey, thanks for your feedback, this was our initial thought however our process engineers don't buy this. Although they are close to the card edge this product only has de-panel length wise which is perpendicular to these capacitors. The PCB its
Electronics Forum | Fri Mar 03 16:05:42 EST 2006 | Chris
Hi, Anyone ever perform a DOE on prepreg glass bundle direction or glass bundle grain and how or if it affects PCB warpage and chip component cracking at V-score depanel? Since most FR4 and prepreg has has 1.4 times more fiber bundles in one direct
Electronics Forum | Tue Jun 14 10:02:11 EDT 2011 | travishemen
Thats .088" from component edge to pcb edge.
Electronics Forum | Mon Jun 20 09:12:55 EDT 2005 | davef
There's no easy answer. It depends on: * Thickness and size of the PCB in the array. * Means of separation. * Type of component. SMT components are more sensitive to the forces that need to be applied to separate the PCB. * Type SMT device. Ceram
Electronics Forum | Wed Aug 08 17:50:22 EDT 2007 | flipit
X7R >Z5U,Y5V Greater means less likely to crack or in other words NP0 is better than X7R for crack resistance. Don't think that there is a set formula. There isn't! I cracked ceramic resonators at 0.050" from the board edge with CAB M2 and M3 dep
Electronics Forum | Wed Jul 27 05:31:09 EDT 2022 | lindsaylbb
Aluminum shreds were found inside the tooling hole after depaneling. We ruled out contamination because the tooling holes were covered during depaneling. Out of three holes, only 2 holes with positioning columns inside have aluminum shreds residue.
Electronics Forum | Wed May 10 13:03:50 EDT 2006 | PWH
It sounds like your depaneling method is good. The only thing left to look at is to see if the depaneler is hitting the part somehow from the cutter or the bottom plates. I've seen time and time again where an operator has a part in contact with th
Electronics Forum | Thu Dec 23 15:10:50 EST 1999 | Victor Salazar
What we did was design or panels with routed out edges held on by tabs. This was very effective. All we use is a pair of pneumatic scissors to cut off the tabs. We are using from single-to 13 layer PCB's and we have had no problems with delamination
Electronics Forum | Tue Jun 03 10:28:09 EDT 2014 | swag
Incoming inspection: Look for flaws and measure position of v-score as well as depth. If v-scored on both sides of panel, make sure v-scores are in alignment. Follow the PCB thru all processes inspecting after each stage of processing, especially
Electronics Forum | Wed Aug 30 05:39:00 EDT 2017 | alexandrdmc
Set 3-pieces, Swimming Mobile Phone Waterproof Dry Bag, iphone waterproof pouch. It is not only have Waterproof effect, it's also can usd the normal use of the phone function, such as Touch, take pictures, send text messages, answer the phone and so
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