Electronics Forum | Tue Dec 10 20:42:43 EST 2002 | davef
Vijay, Sounds like you're not spending enough time at liquidous plus 20*C. And you need to stay there for 5 to 10 seconds. I know, I know. We have used bucketsful of WS609 over the years. See, as you say, the melting point of your solder alloy
Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli
Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta
Electronics Forum | Tue Dec 10 10:26:56 EST 2002 | davef
Questions are: * What is the current plating on the connector that is over the "plating of the leads is Nickel (99.9% purity)"? * What are the temperatures and durations at those temperatures that you read on these connector leads? * What solder allo
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Mon Sep 11 14:07:26 EDT 2000 | Steve
Hi ya'll!! We've got some PCB's in receiving inspection that has these little nodules in plating inside all of the barrels. These are microwave PCB's and have almost all of the surface area on both sides covered with with solid metal planes, and no
Electronics Forum | Wed Jan 09 21:19:49 EST 2002 | davef
When I said "In this area, there is no difference between your experience in ceramic substrates and PTFE substrates." I was referring to the area we were discussing ... gold plating. I am sorry if you thought I ment than the wire bonding process wa
Electronics Forum | Thu Sep 19 21:17:50 EDT 2002 | Sam
We had encountered similar problem before. But the cause was found out to be the poor good plating, instead of contamination. The way we dealt with that was sending them to the supplier for rework. It may be the fastest and most relaibility way. Goo
Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef
Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
Electronics Forum | Mon Jan 07 20:37:15 EST 2002 | davef
For soldered areas, we like to keep gold thickness substantially below the maximum you propose. Search the fine SMTnet Archives for our discussions on the topic of acceptable levels of gold with solder connections. Let�s fix this �no one seems be s
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