Electronics Forum | Wed Apr 14 12:27:49 EDT 2004 | pjc
try Indium Corp's SMQ230. http://ncsmq230.indium.net/ Peak "on board" temps of 229C with good wetting have been obtained.
Electronics Forum | Fri Apr 23 12:47:29 EDT 2004 | barry
I have increased my peak to 220, and Flow is better, but it still not quite a good fillet all around. The solder tends to kinda "bunchup" at the toe of the lead. If part is Pb free, would this affect adhesion and or flow?
Electronics Forum | Wed May 19 07:38:42 EDT 2004 | Bob L.
I'm trying to help one of our remote sites solve a problem with a warped PBGA. The corners are lifted, creating columnar joints and the central balls are sometimes shorting. I've verified that it's not popcorning and I've got samples going to the l
Electronics Forum | Mon Jun 14 17:21:31 EDT 2004 | russ
How old are these parts? Sn/Ni plating is very succeptable to age and everything else. They are possibly tarnished. Also, what is your peak temp in reflow? It takes about 225 230 C to get good wetting to the underlying nickel. Russ
Electronics Forum | Fri Jul 23 08:59:27 EDT 2004 | davef
For reflow, low soak time and low peak temperatures will help reduce the number of components skewing Search the fine SMTnet Archives. For instance: http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6071&mc=15
Electronics Forum | Wed Oct 13 16:24:32 EDT 2004 | shane beard
Every BGA that I have mounted has some degree of scaling in the solder joints. Is this due to a lack of peak temp? Anyone out there have any ideas?
Electronics Forum | Mon Oct 18 13:45:57 EDT 2004 | Steve
OK you have peaked my curiosity. Who makes a wireless wrist strap. And how would you ever dissipate static to a ground if it is wireless? Where would the static go?
Electronics Forum | Sat Jan 15 10:45:04 EST 2005 | Brad
HI, I actually have ask the same question a while back. Yes, using lead free component in a leaded process should be no problem at all. May required just a little hotter peak temp. during reflow, to achive optimal solderability.
Electronics Forum | Mon Jan 17 09:02:27 EST 2005 | russ
I have found that with the TI ni/pd platings that a peak temp of 226 C is the best for joint strength. Russ
Electronics Forum | Fri Feb 18 11:30:27 EST 2005 | austinj
Thanx aj and Russ. I will verify my ramp up/down degC/sec and the soak zone peak temp. Fluxes could be burning off prior to activation. I have found access to an old thermal data logger to help verify the Heller thermocouples. I will post updated fi
