Electronics Forum | Mon Aug 25 08:44:10 EDT 2008 | rameshr
Dear Andrezj, i had attached the photos for ur reference Kindly advice.
Electronics Forum | Wed Sep 03 16:15:30 EDT 2008 | blnorman
Elemental is by SEM/EDX. The brown coloration does resemble the 3 micron photo. Again, if I'm picking up copper (our Ag plating thickness requirements are 0.05 micron to 0.12 micron following IPC 4553), maybe we do have a porous silver plating.
Electronics Forum | Thu Aug 13 11:04:02 EDT 2009 | kdixonttu
Dear Doug, Do you still have a TR1000 that you would be interested in selling? If so, please give me a call or email me the s/n, photos, and the machine location. Regards, Kent Dixon Cencorp VP Sales - Americas 817-366-7876
Electronics Forum | Thu Jan 29 16:48:49 EST 2009 | slthomas
Looks like a time/temperature problem to me. However, there are a lot of solder fines surrounding the pads in one photo that go beyond what I'd expect from inadequate TAL. Is it possible that the board was misprinted and not completely cleaned, or
Electronics Forum | Tue Sep 29 06:14:15 EDT 2009 | Sean
Hi Davef, This photo taken on field returned board. Previously, we never saw such thing..Perhaps, this could be escapee to the field. Anyway, what is the potential root cause at each stage of the process? Thanks, Sean
Electronics Forum | Mon Oct 26 12:40:08 EDT 2009 | awtm
pls find attached photo from Supplier saying that the failure at pth hole was due to blistering caused by moiture evaporate rapidly resulting delamination occur on FR-4 material from an old PCB (3yrs). Pls advise if attached picture confirms such co
Electronics Forum | Wed Sep 15 20:59:23 EDT 2010 | genesan
hi All, Here i snap shot previous PCB(HASL) and current PCB(Immersion Silver).Base on the photo it could be PCB oxidize cause the non wetting?
Electronics Forum | Thu Jan 20 08:22:14 EST 2011 | padawanlinuxero
http://www.flickr.com/photos/94427924@N00/5372753378/sizes/m/in/photostream/
Electronics Forum | Sat Feb 12 06:10:48 EST 2011 | lafir
Flexible substrate coated by PR+, found many open trace. The Photo resist peels off from CU surface randomly creating open circuit during devolopement. Any ideas???
Electronics Forum | Thu Jun 23 07:30:04 EDT 2011 | SBecmpe
That is a very interesting concept. It sounds very time sensitive and would require some specialized equipment to achieve consistant results. Unfortunately I don't have any experience welding anything that thin. If you ever figure it out I would be i
