Electronics Forum: pillow (Page 9 of 9)

BGA Placement Process

Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala

Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u

Re: Altera PQFP240 Solderability

Electronics Forum | Thu Apr 16 13:50:49 EDT 1998 | Lou

| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X

Re: Altera PQFP240 Solderability

Electronics Forum | Thu Apr 16 13:47:36 EDT 1998 | Lou

| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X

BGA Placement Process

Electronics Forum | Thu Mar 25 09:14:09 EDT 2010 | krish_bala

Hello, I have been having some troubling issues when it has come to BGA Placement and I was hoping if there have been others who have been able to resolve similar issues. We are curently doing reworks on a variety of BGA, but seem to be having issu

Whats new in 3D AOI?

Electronics Forum | Thu Apr 27 08:42:22 EDT 2017 | pvasquez

Hello M. We are a low volume high mix manufacturer with a total of 7 Mirtec AOI machines including a new MV-6 OMNI 3D system. I am very pleased with this machine! When we did our 3D AOI research, my team narrowed the field down to 2 vendors, Mirt

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