Electronics Forum | Mon Aug 19 20:45:31 EDT 2002 | davef
Bob Willis and Phil Zarrow have had a running commentary on the ability of reflowed solder to hold components on the bottom side during reflow. You can find references to their component weight to pad area rations in the fine SMTnet Archives. The
Electronics Forum | Wed Feb 18 11:21:14 EST 2004 | Mike Konrad
You have two choices� Change your paste or beef-up your wash chemical. I�ll let others discuss paste options but as far as wash chemical is concerned, consider chemicals specifically designed for such applications. Zestron is promoting A300 as sui
Electronics Forum | Wed Jun 13 15:40:44 EDT 2007 | slthomas
Edited because I completely misinterpreted your post. We used 2 lengths of Durapol with slots for the board edges and a shorty (free-floating, not attached) under the middle. Not much more elaborate than your titanium shims but we had it laying aro
Electronics Forum | Sat Sep 19 09:52:09 EDT 2009 | profilingguru
Before you rule out the profile, did you run an actual profile of the board or run machine characterization? How old are your TCs? Have you run them more than a half dozen times? Is your profiler calibrated. In my experience making a living of pr
Electronics Forum | Thu May 20 18:08:57 EDT 1999 | DEON NUNGARAY
| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | Deon Response:|
Electronics Forum | Thu May 20 19:11:48 EDT 1999 | Earl Moon
| | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | your help is greatly appreciated...thanks | | | | omat marasigan | | | Deo
Electronics Forum | Fri May 21 15:40:58 EDT 1999 | JohnW
| | | hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | | | | | your help is greatly appreciated...thanks | | | | | | omat marasigan
Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman
| | We are about to run our first BGA devices and would appreciate some confirmation on a few points. | | First some details: | | PCB & Device: | | ============= | | 1) 16 layer (4 power, 4 gnd, 8 signal) | | 2) gold on nickel finish | | 3) ceramic
Electronics Forum | Mon Feb 02 12:36:41 EST 2004 | paul_bmc
90% of the assemblies our company produces are class 3 and we have no problem at all inspecting or getting class 3 quality through reflow. Rarely do we have touch up because of insufficient or poorly reflowed solder joints. What are the problems you
Electronics Forum | Wed Jul 02 21:40:44 EDT 2003 | davef
Email me your pix Here how one SMTnetter posted pix: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=6046&#Message24067
