Electronics Forum: practical components (Page 9 of 30)

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 22:31:27 EST 2007 | shy

Hi Stephen, The component falling off is the component that had glue. the component witout glue is being covered by masking during wave. What is the meaning by populated the part and cure it? is it run with solder paste profile or glue profile or yo

Conformal Coat Common Practices

Electronics Forum | Fri Jan 12 06:45:52 EST 2024 | calebcsmt

When conformal coating a PCB, when it comes to components such as alum caps, if no keep-out specified for SMT, would you recommend coating the entire component, or would you only coat the bottom portion (where conductors/leads are present) Moreover,

Tilted/Slant SMT Component Specs?

Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan

Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha

Quad IV C Recommendations

Electronics Forum | Mon Jan 10 17:12:53 EST 2011 | gosswald

I have been researching older lower cost used Pick and Place machines and so far I am leaning towards the Quad IV C. There seems to be a fair amount of these units around and I have heard some pretty good things about them on some of the past posts.

Re: Need help on DFM rules

Electronics Forum | Tue Jun 01 11:43:25 EDT 1999 | Dave F

| Hi, | | To improve the Design For Manufacturing I am currently looking to write down some design rules that can (and should be) used by our engineering department. | | Can somebody help me get started or give some usefull tips on where to find a

Reflow soldering through hole parts

Electronics Forum | Mon Jan 29 16:12:05 EST 2001 | bill_scholl

I have been told that is is possible to reflow solder through hole components. Can anyone confirm this is being done reliably? If so, what are the required equipment, steps and processes? What is the reliability of the solder joints? Is this a genera

Library with SMT Components

Electronics Forum | Wed Oct 13 16:31:25 EDT 2004 | Frank

Strange, the OP said they don't want to use PDF because all the manual work to get the data out of PDF and into what ever system they are using... The data books from Practical are in PDF, so no help there. Unfortunately, I am not aware of any other

Library with SMT Components

Electronics Forum | Thu Oct 14 03:34:11 EDT 2004 | apetkov

I've seen the catalog of Practical and it really can be used to extract the necessary parameters (like every catalog for SMD parts). But maybe the thing I'm seaching for does not exist. So I may create it. Thanks and good luck.

Black pad on BGA after removal

Electronics Forum | Thu May 05 12:00:16 EDT 2005 | russ

Bad cleaning practice is suspect. It is believed that W.S. flux was used to solder adjacent components and then hand cleaned. This is not definite but it is pretty certain.

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 08:21:43 EST 2007 | shy

How many mils the gap between the terminal and pad? Your practice is for technology SMT-4? What is problem with glue cure? is it due to the reflow profile? how long the glue can be keep in room temperature with humidity 40-60?


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