Electronics Forum | Fri Apr 10 07:06:47 EDT 2020 | proceng1
We unfortunately use GERBER data to digitize boards more than any CAD. We are CM and many of our customers do not provide CAD. With some Legacy products, we still use 274-D Gerbers.
Electronics Forum | Thu Apr 07 14:05:53 EDT 2022 | SMTA-69080803
@cbart It's a mid-volume product and as I said, there are several boards (slightly different layouts) using the same component. When you say ISI, do you mean connectors? can you give me an example of what you used in the past?
Electronics Forum | Thu Apr 07 14:11:33 EDT 2022 | SMTA-69080803
@Stephen How big was the adapter board? It's challenging to depanelize and tedious to manually put these tiny assemblies in a tray.
Electronics Forum | Sun Aug 26 12:40:59 EDT 2001 | stefwitt
I would like to enter the discussion by tossing some numbers in. First of all I don�t like the 3 Sigma value. 3 Sigma are 2000 defects per mio. if I remember correctly. This means, if you have 200 components on the board, then every 10 boards have on
Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick
Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a
Electronics Forum | Tue Jun 27 16:29:28 EDT 2006 | Board House
There was a good artical on this in Assembly Magazine October 5, 2005 by Donald P. Cullen, Director of OEM and Assembly Applications, MacDermid Inc., Waterbury, CT Heres the Link http://www.assemblymag.com/CDA/Archives/56840a86f06c9010VgnVCM10000
Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics
This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of
Electronics Forum | Mon May 07 11:02:17 EDT 2001 | Singh
Hi all. I am looking into the implementation of the Chip on Board process with eutactic bonding and the then using either gold or aluminum wire to make wedge type wire bonding. Since I am totally new to this, can somebody guide me thru the process,
Electronics Forum | Mon Oct 15 11:03:24 EDT 2001 | mikecampbell
Dave, Thanks for the info! Yes, I have read the IBM document and realized that I was missinformed about the paste volume. I need 5000 to 5600 cubic mils of paste. Running the numbers I get a 32 mil aperture with a 7 mil step (the rest of the board
Electronics Forum | Mon May 05 22:24:17 EDT 2003 | jlipton
We are investigating a system, using 2-D matrix code, that will identify and track every PCB throughout our factory, starting from bare board. As a low-medium volume manufacturer, would labels or laser marking be more cost-effective? How difficult is
