Electronics Forum | Mon Feb 28 10:11:27 EST 2005 | jbrower
Hi Ing, My suggestion is to take a good look at your profile(s). The Wave solder machine that I use is an Electrovert EPK I. I use Aim ultra pure 63/37 solder with an older kester flux, 920CFX. I recently switched from kester ultrapure to the aim ba
Electronics Forum | Tue May 24 17:07:36 EDT 2005 | davef
Eric: For the amount of dross that you're removing, we're concerned that you could be loosing the balance of your solder alloy, because dross consists primarily of tin oxides. It has little lead in it, beyond than the lead content of the solder that
Electronics Forum | Sat May 28 04:56:23 EDT 2005 | WDLau
Dear, I am looking for the supports, specification, etc of the solderiability of Hot bar Reflow process with: A). FPC plating with sb/pb= 90/10, to be mounted to B) B). Golden plating PCB Please kindly input, As far as I know the melting point of
Electronics Forum | Wed Jul 27 22:14:57 EDT 2005 | Ken
If no-clean...then this seems "relatively" normal. You could try and extend your peak and duration, however, manufacturers are adjusting their chemistry to survive these normal temperatures (up to 260C and 30 seconds within 5C of peak). You will h
Electronics Forum | Mon Aug 15 04:02:38 EDT 2005 | Rob
Purely out of interest & to satisfy my curiosity: Fact: China has been importing huge amounts of SMT equipment due to it's rapid expansion, bringing in used equipment from Europe, US & just about everywhere else, at a not insignificant cost. Questi
Electronics Forum | Fri Dec 16 08:16:41 EST 2005 | davef
Heat cycles deplete the pure tin layer. Each solder cycle reduces the tin thickness by ~0.1 micron (4 uin). So, if you start with a thin imm tin coating you'll have problems after multiple heat cycles. Steve Wentz says, "In almost every case I've
Electronics Forum | Thu Jan 12 01:07:34 EST 2006 | pavel_murtishev
Good morning Mark, CAM (Computer Aided Manufacturing) products are designed to solve such tasks. You can try CAM350 for example. CAM350 understands different ASCII exported data from different CAD systems. CAD ASCII export contains all necessary inf
Electronics Forum | Fri May 26 14:15:16 EDT 2006 | patrickbruneel
Its it possible to post a picture from right after reflow? To see what we start with and compare the difference after 5 years. The grainy structure is not as much a concern as the growth-like appearance on the boundary of the solder. What paste al
Electronics Forum | Wed Apr 11 08:36:23 EDT 2007 | davef
IPC-A-610D refers to 'toe down configuration' several times, beyond the 8.2.5.6 that you question. Although none will add to your understanding of 'toe down'. A lead that is 'toe down' is one where the foot of the lead is not parallel to the pad. T
Electronics Forum | Mon Apr 23 15:28:48 EDT 2007 | ev
To date we are a small niche CM doing prototype and small runs. Any testing we do now is purely functional tests on the pcb ass'ys. In some cases the hardware and software is supplied by the customer, in most cases it's one or the other. We want to e
