Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Thu Sep 16 08:47:39 EDT 2010 | headlad
I extended the pads to help ensure the component locates correctly and to allow for easier re-work should problems occur. I reduced the thermal by 5% but you may want to speak to your fabricator and ask what they require to ensure that the resist is
Electronics Forum | Wed Feb 07 07:45:50 EST 2007 | jax
Water soluble residues probably won't cause instant failures. The failures are most likely caused by excess paste being deposited on the center pad of the QFN. The excess solder keeps the part from sitting down in reflow and increases the possibility
Electronics Forum | Mon May 31 11:04:06 EDT 2010 | aj
Hi Manuel, Do you not have a fine pitch placer?if not may be you need to slow down the placement speed on the QFN - I would imagine you would get a lot of fails trying to use the vision to pick up the component lands. We place thousands of QFNs and
Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob
You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a
Electronics Forum | Tue Feb 11 13:22:22 EST 2020 | rgduval
Sebas, I suspect that your finding of needing the fillet for the card to work is a false finding. One that I dealt with for many years in assembly. As a bottom terminated device, a fillet to the side terminals of the device is not required. Adequ
Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman
Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages
Electronics Forum | Mon Jun 27 09:38:30 EDT 2005 | Bob R.
What problems are the quality people seeing? I hope they aren't expecting a toe fillet. QFNs are typically cut from an array after plating. This leaves exposed copper on the sides of the part. We'll often see smearing from the sawing process that
Electronics Forum | Wed Jul 06 12:04:39 EDT 2005 | sarag
Jason, If you have any pictures of this phenomena that might be helpful for the forum to see in helping diagnose your problem, you can send them to me and I can post them on my website to view. My email is sg_foresite@residues.com Sara Gorcos Fores
Electronics Forum | Wed Jan 17 10:14:37 EST 2007 | slthomas
2-3mm would seem close enough to affect the air flow and I was thinking it could be displacing the qfn. However, if you ran a failed board back through reflow and it was functional after that, I'd put my money on insufficient reflow. I suppose it's
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