Industry News | 2010-08-24 09:51:05.0
Sono-Tek Corporation (OTC BB: SOTK) held its Annual Shareholders Meeting on August 19, 2010 in Milton, NY. The results of Fiscal Year 2010, which ended on February 28, 2010, were reported at the meeting.
New Equipment | Industrial Automation
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Industry News | 2010-06-11 15:20:35.0
DENVER — Krayden, Inc., a leading silicone supplier that specializes in technical knowledge and support for high tech-based applications, introduces the 1-2577 Low VOC Coating manufactured by Dow Corning Solar Solutions.
Industry News | 2022-05-18 12:32:37.0
Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.
Industry News | 2009-08-13 15:17:19.0
FREMONT, CA — August 2009 — Victron, Inc., a premier electronics manufacturing services (EMS) supplier of end-to-end manufacturing solutions to Fortune 1000 companies, announces that Charlie Barnhart & Associates LLC, an industry leading consultancy providing insight and research into the world of global electronics manufacturing, has spotlighted Victron as its featured quarterly supplier at www.charliebarnhart.com.
Industry News | 2019-11-07 14:58:42.0
Weller Tools is co-hosting a technical symposium with industry partners MicroCare Corporation, Aqueous Technologies, ANSYS and TechSearch International, Inc. during the SMTA Silicon Valley Expo & Tech Forum at the Bestronics Box Build Facility in San Jose, CA on Wednesday, December 4, 2019. Weller Tools will exhibit as well as present during the event.
Technical Library | 2019-09-24 15:41:53.0
This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications. The coatings consist of: Specialty (green transparent) liquid photoimageable solder masks (LPiSM) compatible with long-term thermal storage/stress in excess of 150°C. Combined with the appropriate high-temperature base material, and along with a suitable copper pre-treatment, these solder resists are capable of fulfilling higher thermal demands. In this context, long-term storage tests as well as temperature cycling tests were conducted. Moreover, the effect of various Cu pre-treatment methods on the adhesion of the solder masks was examined following 150, 175 and 200°C ageing processes. For this purpose, test panels were conditioned for 2000 hours at the respective temperatures and were submitted to a cross-cut test every 500 h. Within this test set-up, it was found that a multi-level chemical pre-treatment gives significantly better adhesion results, in particular at 175°C and 200°C, compared with a pre-treatment by brush or pumice brush. Also, breakdown voltage as well as tracking resistance were investigated. For an application in LED technology, the light reflectivity and white colour stability of the printed circuit board are of major importance, especially when high-power LEDs are used which can generate larger amounts of heat. For this reason, a very high coverage power and an intense white colour with high reflectivity values are essential for white solder masks. These "ultra-white" and largely non-yellowing LPiSM need to be able to withstand specific thermal loads, especially in combination with high-power LED lighting applications. The topic of thermal performance of coatings for electronics will also be discussed in view of printed heatsink paste (HSP) and thermal interface paste (TIP) coatings which are used for a growing number of applications. They are processed at the printed circuit board manufacturing level for thermal-coupling and heat-spreading purposes in various thermal management-sensitive fields, especially in the automotive and LED lighting industries. Besides giving an overview of the principle functionality, it will be discussed what makes these ceramic-filled epoxy- or silicone-based materials special compared to using "thermal greases" and "thermal pads" for heat dissipation purposes.
New Equipment | Industrial Automation
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New Equipment | Industrial Automation
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