Electronics Forum | Tue Dec 11 02:44:26 EST 2001 | ianchan
SMT Experts, Hi, I have a pondering issue, which is : Our current specified Reflow preheat timing is a necessary 100~140sec for the ranges of 100~170Deg-C....obtained timing is 77sec... out of curiousity, if we further fine tune the obtained reflo
Electronics Forum | Wed Jul 28 17:36:28 EDT 1999 | John Thorup
| Just out of curiosity, who's holding the market for the semi-automatic screen printers these days aside from Transition Automation? I know MPM offers some printers in that price range, but are they holding any real market share in that niche? | |
Electronics Forum | Wed Jul 28 20:20:47 EDT 1999 | Dave F
| Just out of curiosity, who's holding the market for the semi-automatic screen printers these days aside from Transition Automation? I know MPM offers some printers in that price range, but are they holding any real market share in that niche? | |
Electronics Forum | Fri Jun 05 12:57:20 EDT 1998 | Steve Schrader
| My company recently purchased 3 new Phillips CSM machines and is interested in buying a Screen Printer. The one problem we have is that we have to change setups three to four times a day. Due to the small runs of one type of boards that we do. My
Electronics Forum | Mon May 11 13:59:53 EDT 1998 | Chris Fontaine
| Hello. | 1 Could anyone tell me the range of temperature | to solder MI components? The process eng is using 400~500 | degrees Celcius!! For standard 0805/0603 chips & TH components & | also to touch up on ICs. What is the con
Electronics Forum | Wed May 13 16:39:41 EDT 1998 | Herb Pabes
| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What
Electronics Forum | Thu Feb 14 17:36:28 EST 2013 | dontfeedphils
I'm trying to get an '07 Accuflex into production and I seem to have a small problem. When trying to calibrate the zero pressure point on the squeegees I drive them down until they are touching the stencil and once they touch the stencil they run ou
Electronics Forum | Tue Sep 26 20:19:51 EDT 2000 | Dave F
Never heard of N-Tech. Whose material do they use? Two common materials are: Imidazole (Via Systems) and Entek (Enthone) OSP is a lacquer that fabs apply to boards by either spraying or dipping. What thickness control does your fab use? For inst
Electronics Forum | Wed Aug 23 15:10:24 EDT 2000 | Dr. Ning-Cheng Lee
Fillet lifting is a phenomenon mostly observed at wave soldering. It is caused by mismatch in thermal expansion coefficient (TCE) between solder and parts, and aggravated by the pasty range of solder alloys. Upon cooling, the mismatch in TCE will cau
Electronics Forum | Mon Mar 08 10:02:11 EST 1999 | Steve Beck
Hello; I am looking for general info on backplane assemblies. Any info would be appreciated, but some of the questions that come to mind include: -What part types other than connectors do backplane cards have on them? SMT? Leaded? Quantity? Is
