Electronics Forum | Thu May 01 16:27:04 EDT 2008 | chrisawallace
As Mark stated in a different reply, we also send our Pb-free BGA's out to be re-balled with SnPb paste so that we don't have to elevate the reflow temperatures. You have to be careful regarding the individual components on your boards as although m
Electronics Forum | Wed Apr 22 07:54:18 EDT 2009 | clampron
Cood Morning, We have a similar situation. We have had a large volume (5K) of RoHS BGA's reballed with 63/37. We have had only a few failures most of which do not appear to be related to that particular BGA. Potential BGA failures are running under
Electronics Forum | Thu Apr 30 14:41:46 EDT 2009 | bandjwet
There was a paper recently presented by R Cirimele at the CALCE Reliability symposium in which extensive testing was done on a part (thermal stress, vibration, shock) after numerous reballing cycles. This show no failures on the reballed parts. In t
Electronics Forum | Mon Mar 30 16:39:04 EST 1998 | Tony Arteaga
Hello there, I am currently doing BGA repair and basically I am applying the same process as Mike sujested. It is actually the way to go when creating a profile. The next process is re-balling your package, that is if you whant to use the same compon
Electronics Forum | Mon Mar 21 02:41:29 EDT 2011 | kemasta
Hi It's me again. Our products need to pass a chamber test 45c/36hrs after the PCBA completed batch of functional tests and assemble in to case. We found 1 unit was functioning for 24hours in the chamber, but hang after that. We tried to re-boot the
Electronics Forum | Thu Jun 20 15:50:04 EDT 2002 | dason_c
Dave mention b/4 to me, we don't have any industrial standard for the BGA rework. One of my customer request us to bake at 125C for 6 hours b/4 rework. I am lucky and we don't have the component which you are using. I did a evaluation and we found
Electronics Forum | Tue Jul 02 09:29:08 EDT 2002 | dason_c
Ian, First, I baked the parts at 125C for 48 hours and check the weight Second, I soaked the parts above 30C and 60% for 96 hours and check the weight Calculate the weight gain, suppose only moisture add to the parts during soaking, say a Third, dry
Electronics Forum | Tue Jul 16 01:28:48 EDT 2002 | ppcbs
Our BGA Rework process has resulted in 100% yield. We always bake BGA chips at 125 degrees C for at least 8 hours before installation. We always bake loaded boards at 90 degrees C for at least 12 hours before BGA removal. Any parts that went throug
Electronics Forum | Sun Aug 30 16:36:31 EDT 1998 | Steve Gregory
Hi Kc! I went to Surface Mount International last week, and had a chance to see a way to reball BGA's that is very simple, and not expensive at all. I've seen the advertisements in a few magazines, but this was the first time I've seen it live. It's
Electronics Forum | Wed Jun 07 10:56:38 EDT 2006 | Chunks
In the past, I would normally tell out highly talented inspectors to leave the balls there. The were trapped in the flux residue and were hard to remove. Never caused a problem. But then there was an incident where someone had the bright idea to u
