Electronics Forum: reballing and problem (Page 9 of 65)

Re: MoonMan and Tetras

Electronics Forum | Tue Apr 27 09:26:43 EDT 1999 | Chrys Shea

Hey MoonMan, Did I catch in one of your fabulous threads that you're using Tetra stencils? I'm anxious to find out how you're liking them. We we're all set up to go to Tetras, then mgt decided to close down our factor

Re: Voids and BGA

Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon

From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? I

Pick and place labels

Electronics Forum | Fri Sep 24 12:02:57 EDT 2004 | Frank

Yes, I can see your problem, the nozzle makes only good contact in the center and so the ends don't make good contact. The ends tend to curl up during reflow. There were two suggestions to solve this. 1) Let the operator push down the labels befor

Touch-up and Inspection Process

Electronics Forum | Thu Mar 03 09:04:26 EST 2005 | russ

Been following this thread and have a question, Why do "touch-up" people follow different criteria than "Q.C." people. It sounds like the root of the problem is not addressed but bandaids are being put into place. We have no "Q.C." department and

Inspection and splicing

Electronics Forum | Thu Dec 21 13:11:25 EST 2006 | SWAG

We have fought with cut-tape way too much. It's always a bad idea. We've tried a couple methods/devices for manual splice with limited success. Before you look into this I would ask them if they could supply you cut tape qty's inslusive of fairly

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in

IP1 and SSOP28

Electronics Forum | Tue May 18 16:40:22 EDT 2010 | m79d

I am having some problems getting the IP1 to place a SSOP28 package,pitch 0.65mm lead width 0.3mm. I am selecting computer vision 012 (tried 011) and vision type 100. EL data was put in looking at the datasheet and also measuring the device. Have tri

Manncorp Pick and Place

Electronics Forum | Tue Aug 05 21:08:10 EDT 2014 | isd_jwendell

You are correct about the Manncorp machine, it was an MDC machine. The Essemtec machine is old(ish) but still runs fine, and last I knew they were still supporting it. My recent problem with Essemtec was in regards to software. I found a bug and sim

Europlacer feeders and trolleys

Electronics Forum | Tue Jan 05 07:48:39 EST 2021 | mbass

Go for Gen 2 NT feeders, the Gen 1 Feeders tend to be problematic the older they get whereas the Gen 2 feeders are a much better prospect. I've used 8, 12, 16, 24 and 44mm. Some problems to look out for is pull back of coverlay and removal of waste

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar


reballing and problem searches for Companies, Equipment, Machines, Suppliers & Information

High Throughput Reflow Oven

High Throughput Reflow Oven
Pick and Place

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Dual Lane Reflow Oven

Reflow Soldering 101 Training Course