Electronics Forum | Thu Aug 24 09:41:46 EDT 2000 | Dr. Ning-Cheng Lee
The optimal profile to choose is determined by the following factors, (1) thermal mass and distribution across the board, (2) reflow temperature range needed for a particular alloy, (3) the nature of flux. When the thermal mass is small, such as cell
Electronics Forum | Wed Nov 17 09:28:40 EST 1999 | Steve Z
Hello, I am new to the SMT area and I need to know what a "good" vapor phase reflow profile should look like. The fluids we are using have a BP of 45 C and 219 C. Thanks,
Electronics Forum | Thu Jan 16 10:14:56 EST 2003 | barrett1
I have been using silver coated boards for over 3 years and with a Qualitek No-clean solder paste and have used primarily the same convection reflow profiles as Hasl boards.
Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob
I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.
Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
Electronics Forum | Thu Jun 27 13:33:21 EDT 2019 | duchoang
Wash the board or do what ever to get rid of flux /flux residue at the parts before running second side. If you can, use special reflow profile for the second side ( Less heat for bottom side).
Electronics Forum | Mon Dec 04 20:30:40 EST 2000 | Michael Parker
Flavor???? I have always been partial to Wintergreen, but be sure to get it with the Tarter Control for cleaner apertures and baking soda for a brighter finish
Electronics Forum | Tue Jun 14 17:01:18 EDT 2005 | peter ng
It's impossible to do so.The cooling phase is important to perform the strength of the solder joint.Without this phase,the good solderbility will not able to achieved.
Electronics Forum | Tue Jun 14 18:32:44 EDT 2005 | GS
Hi Peter, which should be the best cooling rate once belove TAL by using L-F alloy ie. SAC 305 ? Tnks GS
Electronics Forum | Tue Sep 02 22:03:03 EDT 2008 | davef
Try: * IPC-7530, Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave) http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=3f5288fc-b386-db11-a4eb-005056875b22 * http://www.smtinfo.net/Db/_Reflow%20Soldering.html
