Electronics Forum | Tue Mar 04 18:05:03 EST 2003 | msivigny
Hello Maribel, One way you justify the use of an AOI is to calculate how many defects the system will potentially detect before reflow, associate a repair cost per defect and make the calculation. For an AOI to be effective in this regard, it must sc
Electronics Forum | Mon Jul 27 13:54:25 EDT 1998 | Ted
| | | | I was wondering how successful industry has been in quantifying relationships between defects rates of particular solder problems (like bridging, opens,..) and PCA design parameters (like spacing, part orientation, pad dimensions, ...). For
Electronics Forum | Mon Mar 03 11:06:13 EST 2003 | msivigny
Hi floydl, I completely understand when it comes to data crunching after long hours of performing measurements, it's the last and most important arduous task in obtaining performance data. If a measurement and evaluation process that traditionally to
Electronics Forum | Wed Dec 07 11:56:08 EST 2005 | slthomas
Are you saying you can't send out boards that have been touched up or reworked, or are you saying you can't send out boards with defects on them? 100% is a great goal to shoot for but most people don't expect to achieve it. It all depends on what yo
Electronics Forum | Fri Apr 12 15:48:33 EDT 2002 | jersbo
SPC for each assembly(I use C(for board defects)NP(for unit defects) at the end of reflow to determine process capabilities determine Control limits. Once control limits are set, inspectors stop the process until out of control limit is addressed and
Electronics Forum | Wed Jun 16 04:18:53 EDT 1999 | forrest xie
| | | we encounter BGA soldering issue. there is always some dry joint or unclear defects after reflow and the board can't pass electrical test, but if we resoldering it through hot air gun, every thing is ok. we use the "dog bone" surface pad ,that
Electronics Forum | Mon Jul 23 12:12:57 EDT 2001 | kennyhktan
Good day! As we all know the normal recommended solder paste(Sn62/Pb37) reflow profile time is around 40~60sec above the temperature of melting point. Now I'm setting my peak temperature at the high site of solder paste recommended spec. due to metal
Electronics Forum | Thu Oct 26 17:42:29 EDT 2000 | Philip A. Reyes
Hi Mr Paul! Thanks for answering my previous questions. Hope you can still accommodate my other queries. This is about the acceptable criteria of PBGA defects after reflow soldering. 1.What is the allowable (min and max. ball misregistration / misal
Electronics Forum | Thu Mar 29 12:05:38 EDT 2007 | cecil
OK, just finished our prototype build. PWB 7.5" x 10" 16 layers smallest pitch 17mil smallest BGA pitch 30mil (round apertures) smallest component 0402 total of 1492 placements 5 mil stencil foil (invar) Had numerous PQFN packages that always gave
Electronics Forum | Fri Oct 20 21:26:49 EDT 2023 | dwl
I agree with Sr. Tech. What does the reflowed joint look like? Is there an actual defect in the solder joints? If its good, I wouldn't worry about the print not being text book perfect.
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