Electronics Forum | Thu Aug 19 08:22:05 EDT 2004 | Rafal M.
Hello. I have a problem with reflow soldering of PCBs with golden pads. Peste explodes in the oven. I don't know in witch phase of process (in what point of profile) it happens. It's the reason of problems with golden pads - it's dirty when going out
Electronics Forum | Sat Jan 06 05:17:16 EST 2007 | shrikant_borkar
Hi. How one Can suggest you unless your Involment in your Process? Check Following Points and also Is Reflow Temp - Profile is as Per Glue Mfg. Requirment Are Glue Dot in Sysmetricl Position? Is glue sufficient , below IC to hold ? please visit th
Electronics Forum | Fri Jan 19 07:26:45 EST 2007 | Richard-magictek Tech
kindly send me your reflow profile ---and also the PCB lay out i shall able to determine your process flow on speed....and glue application i can be reach at this email- rdm@magictek.com.cn my web site is ;www.magictek.com.tw we are furance maker w
Electronics Forum | Fri Oct 07 14:59:07 EDT 2005 | gregcr
Hi Jimmy, We use flat belt exit conveyors. They are set-up to collect the boards and set off an alarm when the belt is full. This allows the boards to come out, but you don't have to pay someone to stand there and catch each board. Also eliminate
Electronics Forum | Tue Apr 07 22:34:14 EDT 2009 | 1036
Board delaminated after reflow - see attached picture. Does moisture cause this problem?
Electronics Forum | Mon Sep 06 20:18:37 EDT 2004 | charly
hi, we are running high mixed low volume here, and i encounter many pcb delam after reflow issue. here some doubt need ur advise: 1. actually, what is max temperature and duration can a bare PCB reflow without any quality problem? if i allow bare
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Fri Oct 07 14:37:36 EDT 2005 | jimmyjames
Could I get some help please? I have a Heller 1700EXL, 7 zone oven and I'm trying to figure out a better way of off-loading my completed boards. What I have now is simply a small table at the exit of the oven with about an 8" drop from the top of
Electronics Forum | Tue Jun 25 23:54:54 EDT 2019 | anhsang38
Dear Everyone, I'm having problem. the Switch component drop after reflow. First, this component placed on top side and through Reflow. Next, the Bottom side is placed component and through reflow. After that, the switch drop and have a gap. We are u
Electronics Forum | Wed Apr 08 11:33:51 EDT 2009 | 1036
2) STD FR4 material with HASL finish, 4 layer board. Reflowed under tin-lead temps with another 4 layer board same time(no delamination problem). 3) We uasualy do not pre-bake board unless board is too old. 4) We do not have the board on hand right