Used SMT Equipment | SPI / Solder Paste Inspection
Koh Young 3030VAL SPI Vintage: 11/2007 3D Vision SMEMA conveyor with Bottom Up Side Edge Clamping Measures: Volume, Height, X/Y position, area Voltage Requirement: 200-240V Includes: (Base Unit, 1 Programming Seat, Real Time 3D viewer, Bare Board
Used SMT Equipment | Screen Printers
WATCH this industry leader out print them all NOW on our website under videos WINNER ! ! This system took the GLOBAL TECHNOLGY AWARD for 2011, presented at the Productronica show in Germany. Than took the Circuit Assembly award at the APEX Show 2
Industry News | 2018-09-04 10:25:16.0
Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.
Industry Directory | Distributor / Manufacturer
AOI Vision is the specialized supplier of advanced materials and engineering solutions for SMT PCB screen printing industry. We team up with industry leaders who are equipped with cutting edge technology and innovative products.
Catering to customers’ ultra-long printing needs, P-LED is the ideal printer that serves long LED Tube PCB up to 1.524m length. The 2D paste inspection function is able to detect insufficient paste, bridging and other defects. Like all our othe
Technical Library | 2014-06-05 16:44:07.0
Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
Economical and practical AOI High precision detection platform design Fast programming debugging integration Automatic recognize the Top and Bottom side Professional SPC system Small and medium-sized growth enterprise special products Effic
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The patented technology control system of Z axis AOI can inspect component side of PTH technology. Simpler debugging algorithm, make the programming easier and easy to learn. shift of two sides of board (components top and bottom), auto software or
New Equipment | Solder Paste Stencils
DEK’s Nano-ProTek technology is a permanent, hydrophobic nano-coating that, when applied to the bottom-side of the stencil foil and stencil aperture walls, minimizes solder paste’s ability to stick to the foil surface. Up to a 10X increase in the num
New Equipment | Solder Materials
Solves: QFN Voiding | Head-in-Pillow | Graping Indium8.9 is an air or nitrogen reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by t
