Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
Electronics Forum | Thu Oct 30 22:29:58 EDT 2008 | davef
For most applications, a nice square [or rectangle] pad works just fine. Assemblers ship boat loads of boards with these every day. It's reasonable for tight decoupling capacitor requirement applications to use round or radiused pads for components
Electronics Forum | Thu Nov 04 09:00:01 EST 2004 | russ
As stated by others you are out of IPC compliance, However, There are allowable deviations to the standard as long as the purchaser and manufacturer come to agreement that the non-conformance will not affect form fit or function. I would recommend
Electronics Forum | Wed May 24 16:19:58 EDT 2006 | inds
John, there have been quite a few discussion on Mixed Assemblies in this forum.. do a search.. you will get whole lot of information.. in addition - IF you are using Lead-free reflow profile...make sure the rated temp for Sn-Pb components is not vi
Electronics Forum | Wed Nov 29 08:25:28 EST 2006 | aj
Hi, I work mainly with Fujis but have some experience with Panas. If you are seeing components upside down on the board it is feeder related . If you are seeing poor alignment across the board , firstly I would check the xy table for alignment. Mak
Electronics Forum | Sun Jul 02 23:39:27 EDT 2017 | bentepcb
I found that some guys in the forum will raise a question and answer the question by themself, just intend to attract others attention, and then sell their products. There's nothing wrong with selling your product, but if you intend to promote your p
Electronics Forum | Fri Jan 22 18:54:54 EST 1999 | Steve Gregory
> If you are inheriting a system, you probably don't have a lot of choice, >>but with a little ingenuity, you can pull a Steve Gregory: Grab some duct >>tape, a book of matches, and a videotaped rerun of MacGyver for >>inspiration. HEY! Whaddya mea
Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon
| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or
Electronics Forum | Thu Apr 19 20:01:30 EDT 2012 | eadthem
some things to consider, Is there flux on the board. are there finger prints on the tops of parts. Is the board warped at the V score from reflow Is the board shifting in the machine during inspection. These are the issues we have had with our mir
Electronics Forum | Mon Feb 26 16:26:00 EST 2001 | jax
I have not placed these parts in a while but when I did Universal was the machine that did it. We were able to place these parts using a 1mil flat( upward looking camera) inspecting all columns. The problem is a 100% column recognition is not possibl
