Electronics Forum | Wed Sep 20 10:42:05 EDT 2000 | Erick Russell
Process control for Photonic soldering is based on the actual temperature of the component being reworked. If the desired temperature of the component for your process is 200C then that is the process temperature programmed. This is achieved by a cl
Electronics Forum | Tue Jan 03 11:01:19 EST 2012 | julie331975
We are working with .065" thick metal core PCB's. I have a couple boards that are in need of rework. The components we are placing are similar to a SOJ package with a solder pad underneath the component. We are also using a lead free process. I have
Electronics Forum | Thu Jul 13 02:30:29 EDT 2017 | jandon
We are using hot-plate. It is the safest method to rework aluminum substrate PCB's. http://www.martin-smt.de/en/rework/products/pre-heater-hotbeam.html "For efficient rework on heavy electrical systems with flat bottom surface and LED PCBs the pow
Electronics Forum | Wed Apr 03 14:16:16 EDT 2019 | davef
My take ... * Just about every BGA in the world is soldered in a reflow oven * A small portion of the BGA are soldered with rework / repair stations * A very small number of BGA are soldered with hot plates, toaster ovens, selective soldering mach
Electronics Forum | Fri Jul 16 20:17:15 EDT 2004 | cisridn
Hello! I am an Electrical Technician with Filtronic Comtek. I am responsible for all of the Engineering changes and rework done to prototype and pilot run PCB's. My current rework equipment includes: Soldering irons, heat gun, and hot plate. Consid
Electronics Forum | Wed Feb 13 08:15:05 EST 2019 | SMTA-Joe
We recently had an in-house demo with the smaller IR bottom heater PACE machine. The machine was barely able to remove some components, but could not replace new ones at all. Also, the nozzle for the hot air would not fit in the tight areas of the ho
Electronics Forum | Mon Aug 24 21:43:28 EDT 2009 | davef
In reworking 0201, we: * Cut the 0201 in half with a side cutter * Heat the solder on each pad separately and flick the half 0201 off the board * Preheat a new component to +150°C with a hot plate * Solder a new 0201 on the undressed pads with a hot
Electronics Forum | Thu Dec 17 03:25:00 EST 2009 | tod1967
Not sure if Multicore/Henkel still offers it, Prozone is an outstanding chemistry for RMA removal. Heated to a relatively low temp. No Ultrasonics necessary. Could use a Pyrex Beaker Hot and Hot Plate to test.
Electronics Forum | Wed Feb 13 10:39:36 EST 2019 | spitkis2
The QFN will add an insignificant amount of thermal mass since its all in the housing. You just need to make sure the package does not exceed the recommended peak and duration so as not to damage the die internally. Usually the limit is around 250-
Electronics Forum | Tue Dec 26 22:18:20 EST 2006 | davef
Common methods to replate components are: * Barrel plating http://www.finishing.com/Library/zemo/barrel.html * Hot solder dipping - MIL-F-14072 M258 Certainly you can do this yourself by dipping the component leads into a solder pot containing lead
