Electronics Forum | Thu Jun 19 21:39:31 EDT 2008 | mika
Hi, we used to have a RoHS package with uBGA 380 Solder ball's 0.8 mm pitch approx 15x15 mm, bump size is 0.4mm on a 0.33mm pad. Suddenly we need to use another vendor for various reasons. However, the new bump size is 0.45mm according to specs and t
Electronics Forum | Fri Jun 16 20:40:43 EDT 2006 | mika
Hi Grant, I understand your concerns about the reliability. It depends what the boards are use for. For ex. if it is in a telecom system market where lifetime and reliability is a big issue 10-20 years lifetime (our customer reqs. that at the system
Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman
Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing
Electronics Forum | Wed Nov 08 09:01:14 EST 2006 | markhoch
Oh yeah, I forgot to mention this is a RoHS compliant PCB. (As if it weren't difficult enough!!)
Electronics Forum | Thu May 29 17:18:51 EDT 2014 | island2013
whats the type of paset and the type of profile you're running. Doesn't look like enough heat to me on the first set of pics I see. Are you running ROHS BGAs on a lead profile?
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Thu Mar 01 19:38:12 EST 2007 | Wayne
1) run the BGA side first. set the bottom temp lower (if your reflow oven have top and bottom temp setting) for connector side while doing your 2nd reflow. 2) run the BGA side first with your normal leadfree paste, and run the connector side with low
Electronics Forum | Thu Mar 01 12:08:33 EST 2007 | rob_thomas
It sounds like something is a little off here. ROHS compatible and ROHS capable parts are going to be ok with a leaded solder paste and processing unless you are building high reliability product.( some are going to argue that even high rel products
Electronics Forum | Fri Feb 05 14:39:50 EST 2010 | gregcr
Hi All, We evaluated and approved KESTER R520A for our default RoHS solder paste a couple years back. It's time to re-evaluate to see if this material is still the best choice. Please let me know your opinion on the solder paste you are using, and
Electronics Forum | Tue Oct 25 11:48:03 EDT 2016 | dontfeedphils
Hi, we're currently running a design with a fairly simple BGA. The problem we're running into is poor solderability (cold looking joints, high voiding in the BGA). All of this on a know good oven, with a known good thermal profile. I'm guessing it
