Electronics Forum | Wed Jan 23 17:14:33 EST 2002 | Shawn
We have seen solder joints that have an orange peel or textured appearance to them after running over our wave solder machine. We thought it may be disturbed solder joints but it does not have the lines or appearance that a disturbed joint usually sh
Electronics Forum | Tue Jun 03 18:34:22 EDT 2003 | Kris
Hi, There have been other studies where it was found that lead-free soloder joints are more reliable than tin-lead solder joints irrespective of test conditions. In fact the automotive industry has been using Sn/Ag for underhood applications for a
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Wed Feb 25 01:24:34 EST 1998 | Steve Gregory
Dave, I confess I was a tad too general and a bit too extreme describing the way ALL solder joints look on palladium coated leads. I should been more specific about the "pillow-effect". I've seen it regularly with palladium coated leads on small SOT
Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM
I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can
Electronics Forum | Wed Feb 25 09:40:31 EST 1998 | Doug Romm
Steve, TI does not produce any SOTs using Palladium finish leadframes. I would certainly be interested to know who is. Also, your observations are correct: In TI experience the mechanical strength of the solder joints with Pd finish ICs is alw
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval
We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo
Electronics Forum | Tue Apr 08 12:38:12 EDT 2003 | Denise
I'm looking for comparison data on MTBF for solder joints meeting IPC Class II vs Class III.
Electronics Forum | Sun Aug 01 11:39:41 EDT 2004 | Andrew
I am seeing high rate of open joint at NexLev connector and also BGA warpage issue with 52 mm Hyper BGA.anyone has the same experience?
