Electronics Forum | Wed May 15 19:55:19 EDT 2002 | russ
Good point, I am preheating for 90 sec to a temp of 170 C. (PCBA) then reflowing for 40 sec. to bring it to 215 C. I will try a softer hammer. This has been working on other assemblies with the same package however. Do you know if a water soluble
Electronics Forum | Tue Jul 08 20:43:03 EDT 2003 | davef
AlCapone: We have an understanding similar to yours, but slightly different. * At 230*C gold dissolves in to solder at the following rate: 63/37: 197 uinch/sec [5 um/sec]. So for a typical ENIG solderability protection, the gold is gone in about a s
Electronics Forum | Tue Mar 30 08:11:42 EST 2004 | steveliu
Hi, Has anyone here get some experience with SMT connector soldering? We were having really hard time to solder this AMP 50/50 Grid connector. Every connector installed has a few pins just sit on the solder. We use AIM 293DX2B NC solder paste, 60
Electronics Forum | Wed Apr 28 12:16:09 EDT 2004 | paul_bmc
We usually make a template offline to put with the assembly file. When it is time to run, place the pin support template in the machine, place your pins and your ready to go. Probably about a 15 sec setup. We looked into the ready-e-set pin suppor
Electronics Forum | Thu Jul 29 09:00:56 EDT 2004 | Bryan Sherh
Some short happens between the balls of CPU socket in my site.we decrease the reflow time from about 90sec to 50 sec and decreased the fail rate of short.but x-ray shows balls from part of the Ball array deformed....we can't further decrease the time
Electronics Forum | Fri Aug 13 18:38:47 EDT 2004 | russ
Your paste manufacturer will have the best guidelines for you. Different paste types and manufacturers sometimes/usually require a little bit different setup. I would also contact your printer manufacturer. As far as stencil concerns the larger/be
Electronics Forum | Tue Oct 05 17:37:21 EDT 2004 | mikecollier
We currently use a KIC 2000 system to profile on our oven and create our recipes. I had a customer in today reviewing our profiles, and he had concerns that we were exceeding 4 deg. c/sec. on our profiles. The process window parameters that we use
Electronics Forum | Tue Oct 26 13:45:19 EDT 2004 | vinod
Hi friends I am using Alpha Metal WS709 solder paste. I know the spec for this solder paste. It recommends straight ramp to 220 C at 0.9 degree/sec and TAL 75 sec.So I am looking between around 27-220 temp around 215 second. And time above 183 not to
Electronics Forum | Tue Oct 26 13:45:23 EDT 2004 | vinod
Hi friends I am using Alpha Metal WS709 solder paste. I know the spec for this solder paste. It recommends straight ramp to 220 C at 0.9 degree/sec and TAL 75 sec.So I am looking between around 27-220 temp around 215 second. And time above 183 not to
Electronics Forum | Sat Oct 01 01:04:47 EDT 2005 | ck
I face a problem where the components termination is non lead free but solder alloy is lead free. Thus i am using hybrid reflow profile. The specs for the reflow profile i am using: reflow temp. 120 to 160 deg C; time 90 to 120 sec. As for the pak te
.gif)
