Electronics Forum | Thu Oct 16 10:17:51 EDT 2008 | kevslatvin
I'd start by looking at the available tips from the manufacturer of the iron you are using. They usually have a selection of specialty tips in their catalog either online or in print.
Electronics Forum | Tue Feb 23 12:56:03 EST 2010 | vleasher
Is there any harm in washing SMT soldered with NoClean paste? The PCA has some large thru-hole connectors that we would prefer to do as water soluble on out selective solder but the SMT consists of LGA's and other low parts that we would not be able
Electronics Forum | Fri Jan 17 16:36:04 EST 2003 | MA/NY DDave
Hi As DaveF notes there are many sources. In one of my lives, I used to generate this business for one of the really good outfits i.e NTCu in Bethlehem, PA and I know of several more. You probably already get NTCu's mailing if you have been in the
Electronics Forum | Wed Sep 01 13:58:10 EDT 1999 | Dave F
| Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective w
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Mon Feb 23 16:59:43 EST 1998 | Doug Romm
Dave, "Paladium Pillows and Bad Dreams"....that's a good one! I've been doing this for the last 9 years and I've heard quite a bit, but that's really cute! Seriously, in reference to the 'pillow effect' when the lead looks like it is "sitting" on to
Electronics Forum | Tue Feb 23 16:45:36 EST 2010 | dyoungquist
Davef is right on as usual. We are doing exactly what you do. Some smt with no clean paste then the plate through connectors on our selective solder machine using water soluble flux. We then clean with a ultrasonic water process. We do see the re
Electronics Forum | Mon Jan 17 17:38:29 EST 2011 | bandjwet
All: I am reaching out to get some suggestions on the right flux to use as well as a recommended cleaning process for soldering a KOVAR RF shield using 80/20 Au/Sn solder to a ceramic hybrid. The recommended profile is 4-5 min at 280C and at least
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
Electronics Forum | Thu Mar 10 09:13:15 EST 2005 | davef
From http://www.IPC.org ... IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components, includ
