Electronics Forum | Sat Dec 19 04:05:19 EST 2009 | dilogic
You'll need to generate two signals - board in and board out. We have GSM that operates that way. I can send you the schematic (it's very simple) if you like... - Deni
Electronics Forum | Thu Mar 15 18:27:40 EST 2001 | traviss
Like I said it was only a rumor I heard but intrigued me enough to play around with it one day. The lambda wave worked better than the chip wave did with makes me believe it was the surface tension of the solder not melting the already soldered parts
Electronics Forum | Fri Apr 10 15:59:51 EDT 1998 | Justin Medernach
| We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The
Electronics Forum | Wed Mar 14 21:05:59 EST 2001 | davef
Mike makes a very good [ no, make that excellent!!!] point about reflowing solder at the same time you are curing glue. There is some evidence that the outgasing during the cure of glue can affect the LT reliability of solder connections. [Regardles
Electronics Forum | Fri Mar 16 17:50:45 EST 2001 | djarvis
Steve, I did this several years ago on a terribly designed board that left a lot of joints unsoldered after the wave. It works OK. This was a bog Irish board with nothing fancier than SOP packages. Glue was Amicon D125. Happy St. Patrick's Day everyo
Electronics Forum | Thu May 16 11:37:13 EDT 2002 | fmonette
My company offers a simple and cost effective control system for MSDs on the factory floor. It is a turnkey solution to comply with J-STD-033. If you want more information feel free to contact me offline. Francois Monette Cogiscan Inc. Tel : 450-53
Electronics Forum | Mon Aug 19 04:57:17 EDT 2002 | surachai
SIPAD solid solder deposit and glue dots is an > excellent solution. > > http://www.sipad.com > > Matt > Kehoe SIPAD Systems Inc Thank you for your information , but I would like to know the information of normal process like a flip process bu
Electronics Forum | Mon Mar 05 14:44:51 EST 2007 | daxman
Hey, I've seen a lot of AP25's with snuggers. I don't know if they all came with the pneumatics or not..but if you have the snugger reg. guage, just underneath the Z table, you should be okay. The fellas at goppm (www.goppm.com) have a lot of knowl
Electronics Forum | Tue Mar 06 06:34:13 EST 2007 | pavel_murtishev
Good afternoon, We use both brands. Speedline�s latest printing machine generation is as good as DEK. It�s my humble opinion only. But AP 25 vacuum support system starts to fail even with fine pitch. Thanks for your input anyway. BR, Pavel
Electronics Forum | Mon Mar 26 09:12:48 EDT 2007 | stepheniii
I don't do wave soldering but want to see if I understand the question here. Do you want previously soldered component joints melting when you wave a board? I don't think you really want that? Or is it you want to avoid it? Are you talking SMT parts?
