Electronics Forum | Fri Jun 07 14:14:24 EDT 2019 | teejsd
Yes neither our HPLC IC nor our C3 could detect any concerning levels of ionics. Soaking over a weekend sounds like a good idea, though I may still need to cut the board down to fit our Kapak bag size. And get our silicone coating off the surface. K
Electronics Forum | Tue Dec 05 10:12:51 EST 2000 | blnorman
Being in the automotive electronics industry, we use silicone (Dow 4105 is one in particular). I'll ask the same question - What are your reliability requirements?
Electronics Forum | Fri Apr 07 11:52:44 EDT 2000 | Ashok Dhawan
Can anyone suggest a cleaning solvent for removing silicon residue after K Tape has gone through 2 cycles of reflow soldering ? The solvent or cleaning method has to be compliant to IPC Standards - to be used for cleaning gold edge fingers - PCB asse
Electronics Forum | Tue Jun 06 18:36:21 EDT 2000 | Mohsen Esmailpour
Which direction is the industry moving to for cooling high-end electronic devices/boards? Is there anything innovative taking place beyond liquid cooling and refrigeration? Is anyone developing cooling techniques which are integral part of the devic
Electronics Forum | Thu Jun 07 16:12:36 EDT 2001 | csullivan
Does anyone know of a good masking material for conformal coating? The coating is silicon based. Any help would be greatly appreciated. Thanks
Electronics Forum | Mon Jul 09 20:43:00 EDT 2001 | davef
I used http://www.google.com to find the following link: http://www.geocities.com/SiliconValley/Cable/5930/misc/cadexten.html
Electronics Forum | Fri Feb 05 21:34:25 EST 1999 | Raymond Bellamy
I am looking for a piece of equipement that can safely remove silicon die(200mil by 200mils) from a LTCC board. My present method involves a dental drill which often goes through the dielectric layers and causes scrap.
Electronics Forum | Tue Oct 20 10:57:18 EDT 1998 | Craig Ramsey
Dear Bob, The Tessera microBGA technology defines a family of CSP devices. The most common microBGA type is the TV46 that has been selected by Intel for use with their flash memory devices. A microBGA package in general consists of the silicon die
Electronics Forum | Tue Jun 02 15:53:32 EDT 1998 | Earl Moon
| We have experienced poor adhesion of acrylic conformal coating to plastic bodied IC�s. The observed symptoms of this are a blistering or lifting of the coating at the surface of the component, although peel testing has revealed that this is not al
Electronics Forum | Wed Apr 17 11:41:50 EDT 2002 | davef
Ask Steve Gregory [ stevezeva@aol.com ]. He worked at a silicon valley memory module contactor a few years ago. Good guy. He'll get you started.
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