Electronics Forum | Wed Apr 06 22:59:02 EDT 2005 | smt_rookie
It is the solder ball that's usually encountered in a reflow process. It's just that, the paste did not wet well along the connector pins. Before reflow, the paste is actually at the tip of the connector, and stayed there and never went up to fill th
Electronics Forum | Mon May 16 07:59:50 EDT 2005 | johnw
ok guys here we go I am looking for production simulation software I am presently working on a project to enhance my Fuji smt lines production yeilds and throughput can any of you guys suggest what factors need to be taken into consideration and is
Electronics Forum | Tue Oct 13 22:56:22 EDT 2009 | cpcompany
Can anyone help me recommend or simulate a SPI > and AOI machine that can balance our FUJI NXT 1 > with 14 modules. We are using MPM accela printer. > 200 UPH is our target. > > Here's the PCB > dimension > > length(x) = 399.92mm width(y) = >
Electronics Forum | Thu Sep 09 12:01:35 EDT 2010 | davef
We're guessing the ink wasn't fully cured, when they finished the ENIG. If the supplier is correct that it was your 'process that is caused the changes,' then they certainly won't mind you bringing over a couple of unstuffed boards and running them
Electronics Forum | Tue Dec 28 03:59:06 EST 2010 | riscy00
I'm investigating heat transfer by 1st order approximation between PCB and ambient air via encapsulate material (epoxy or gel or silicone), they have thermal conductivity of 0.2W/C but it hard to find specific heat capacity and density. Has anyone
Electronics Forum | Wed Apr 04 09:20:20 EDT 2012 | acsscott
I have continued to try and make this work, but I've had no success. I have tried everything that everyone has suggested. It might be the component height, but I can't change that. I guess I could increase the resistor thinkness, and add some heig
Electronics Forum | Tue Feb 05 16:06:48 EST 2013 | mlevesque
We are looking for a new BGA rework station. We got an ERSA IR550A and we are not very satisfied. I'm not sure that IR reflow is the better solution because the top-side heating is too large. I think is better with a convection "forced-air" heat.
Electronics Forum | Wed Aug 21 08:00:11 EDT 2013 | alexeis
Hi, We have software solution (called QPlan) for I-Pulse (Tenryu) SMT machines: 1. It helps you to merge all needed information including verification of imported information. 2. It simulates and fixes deviations and angles, and generates report, ch
Electronics Forum | Mon Apr 28 02:22:52 EDT 2014 | jkhiew
We found repeated pad lifted after different SMT Reflow temperature (eg: 243 deg C and 233 deg C) at an isolated slot. The PCB Supplier had claimed that such condition is acceptable as per IPC 600H Clause 3.3.2 (Cross Sections) - eg: Acceptable - C
Electronics Forum | Mon Apr 28 15:20:50 EDT 2014 | davef
Your customer is correct. Your supplier has clamped some sort of machine to your butt and has plugged it in the wall outlet. Honest mistake: * IPC-A-600H, 3.3.2 Lifted Lands - (Cross Sections) ... pertains to boards that were cross sectioned after t
