Electronics Forum | Fri Jan 08 18:28:04 EST 1999 | Bill Schreiber
When going to a "no clean" process, there are always two items that will require cleaning - stencils and pallets. You may also have a requirement to clean misprinted PCBs and possibly SMD adhesives. The Smart Sonic Stencil/Pallet Cleaning Process
Electronics Forum | Wed Aug 14 03:14:39 EDT 2002 | lloyd
Thanks for the replys'. So are you saying that SMD adhesive contains a flux agent?, because at this point in the process the boards have no solder on them at all, it's all done at a solder bath after the chips have been bonded.
Electronics Forum | Mon Nov 23 20:16:11 EST 2009 | davef
We're not familiar with Loctite 3606. Adhesive bond strength must be adequate to survive handling forces between the adhesive cure station and the soldering station. At the soldering station, the adhesive will soften during the preheat stage and in
Electronics Forum | Mon Aug 27 15:02:45 EDT 2001 | davef
It�s uncommon to test green strength. [Whatever �green strength� is. Some chip bonder adhesive suppliers have taken to taking about improvements in �green strength� their literature. We have asked sales types to quantify this and have never heard
Electronics Forum | Sun Apr 19 13:52:45 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Sun Apr 19 13:50:41 EDT 1998 | D.Lange
| We have to mount our SMD devices 0.1 to 0.4 mm off the pcb | PCb substrate to compensate for thermal stressing in a | Space enviroment. Has any one any ideas or contacts for | dissolvable pads. this only applies to leadless components Robert, PPI
Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F
Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr
Electronics Forum | Tue Nov 27 19:50:23 EST 2001 | davef
So, which is it �falling off or tumbstoning�? Each has different causes. You say �It's apparent that these components were cured and in place prior to wave solder.� * Cure heat cycle maybe. But is the glue holding? I mean if your cure is real good
Electronics Forum | Tue Nov 27 11:06:53 EST 2001 | scottdavies
Sounds like they may be hitting some kind of submerged obstruction in the wave, maybe? Is it only MELFs that are affected, or any other similar sized components, such as Tantalum caps?
Electronics Forum | Tue Nov 27 11:06:45 EST 2001 | scottdavies
Sounds like they may be hitting some kind of submerged obstruction in the wave, maybe? Is it only MELFs that are affected, or any other similar sized components, such as Tantalum caps?
