Electronics Forum | Mon Nov 26 20:11:41 EST 2007 | shy
Yes, i'm agree with you davef but i'm not put the chipbonders onto pads. i'm put the chipbonders at the beneath component (center between both component terminals) which the idea is to hold the component during wave soldering which might cause the co
Electronics Forum | Tue Nov 27 08:13:04 EST 2007 | davef
C1: is there any gap between the pad and terminal if we place the glue? R1: Yes, there is a gap, but it is easily bridged by the amount of solder in the wave. C2: Btw, my practice to print solder pate then punch glue then PNP component and finally
Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy
Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t
Electronics Forum | Tue Dec 14 14:26:20 EST 1999 | John Thorup
Sure KA, it's done every day. Be sure that the components to be used on the bottom can take the maximum heat of the wave and the delta T of entering the wave. Depending how complex the bottom side is you will get better results with attention paid
Electronics Forum | Sat Nov 09 15:13:06 EST 2002 | mjabure
If I understand what you're saying, you are reaching reflow temp's on the top side while soldering bottom side components. You might want to run a glass gauge plate over the wave and make sure your contact pattern isn't too large. If your PCB is in c
Electronics Forum | Fri Dec 17 09:24:46 EST 1999 | Marty Wetzel
KA, Joshua makes a good point. A wave solder fixture will allow you to process your double-sided boards without having to add the epoxy step. The one time fixed cost of a fixture is quickly offset by the time that you save by not gluing your SMT.
Electronics Forum | Thu Aug 10 05:53:10 EDT 2000 | pascal MATHIEU
hello everybody , i am looking for the elementary caution you need to take when you reflow large board with several thousands of smt components . thank you for your advise
Electronics Forum | Sat Nov 09 08:04:52 EST 2002 | erhard
if you wave solder you have to glue the SMD parts on the bottom side. If you reflow the bottom side then you usually shouln't go over the wave afterwards. It's quite logical the joints melt again, that's what you want to achieve going over the wave.
Electronics Forum | Wed Dec 15 04:59:40 EST 1999 | Joshua Hall
Hello KA, When producing in kind of PCB product you have to base much of your decision on cost effectiveness, time, and quality. In order to get the best of all three you have to decide which you want to be your top priority. By adding an epoxy to
Electronics Forum | Fri Dec 17 03:38:53 EST 1999 | cklau
Hello Guys; I "ll like to add some comment on Mr John message , see below.. "Be sure that the components to be used on the bottom can take the maximum heat of the wave and the delta T of entering the wave."-John The required preheat temp , that i
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