Electronics Forum | Fri Sep 02 08:16:14 EDT 2005 | pjc
From Ray P. Prasad's article in this month's SMT magazine about the new IPC-7095 revison: ".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some
Electronics Forum | Fri Jul 06 18:17:34 EDT 2001 | davef
We find no solder balls after washing our boards. It works GREAT!!! ;-) Probably more to the point, look at "Circuits Assembly" 7/01, p 40, "Eliminating Solder Beads In No-Clean PCBs". "Solder mask type & composition are the greatest contributor t
Electronics Forum | Fri Sep 02 06:47:17 EDT 2005 | dougs
Is there a standard that we should aim for in respect to the strenght of the solder on SMT leads? We have a customer who are testing our product by pulling leads off of pads then returning them.
Electronics Forum | Wed Mar 28 13:14:38 EDT 2007 | amelara98
I am having problems with a product we receive from our overseas plant, where there is excessive "dullness" of solder joints/metal surfaces after running a board on a pallet through wave solder. Seems to be an issue of the pallet, as the solder appe
Electronics Forum | Sun Jun 30 20:00:56 EDT 2002 | redmary
the SOIC encounter solder crack after reliability test, the common process is: SMT---manual soldering---IPT(in process test)---potting---T/C(thermal cycling,only add current and voltage)---B/T and F/T (burn in and functional test). the condition is 2
Electronics Forum | Tue Oct 02 12:56:41 EDT 2001 | Scott B
We have come across this where the operator was using thin gauge solder wire (more suited to fine pitch SMT soldering) to form large solder fillets (power connections or sheild cans). We found that the operator was feeding large amounts of solder wir
Electronics Forum | Sat Aug 05 12:12:05 EDT 2000 | Ramon I Garcia C
Hello Friends: I'm new in SMT process, I have a problem with little balls of solder beside of the component, I'm tried reducing the apertures in the stencil and making home base, some times the balls desappear, but some time not, and some times
Electronics Forum | Wed Mar 28 14:11:19 EDT 2007 | pjc
It should only be a visual thing. What may be happening is that all the thermal energy being driven into the wave solder pallet to get good soldering is causing the no-clean residues to burn up a bit, causing the discoloring. Check to see if they hav
Electronics Forum | Wed Feb 07 21:56:00 EST 2001 | davef
Every critter out there with large incisors adapted for gnawing and nibbling has a different theory of solder ball formation. [My theory: It�s punishment for using NC fluxes. Stand and deliver. My solder balls end-up in the gross filter connected
Electronics Forum | Mon Dec 30 23:37:47 EST 2019 | agoesfirmanto
Hello All, I am a SMT Engineer from Indonesia, I am facing the problem of soldering balls in only one IC location, in other areas there are none. solder ball defect almost 30%. I have done several actions but failed to reduce the solder ball. 1.
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