Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Fri Jun 19 09:08:36 EDT 2020 | SMTA-Davandran
Thank you for the input
Electronics Forum | Thu Sep 17 15:21:50 EDT 2020 | lpbro
For height, I start +-2mil usually. For 3mil stencils, my lower limit starts at 1.5mil, upper is 5. If the area is chem ethed, I normally add .5 to the stencil height. My default volume is 60 - 160%. Then print specs are adjusted till I see fit, then
Electronics Forum | Fri Sep 18 01:34:58 EDT 2020 | SMTA-64386317
Thank you for your input.
Electronics Forum | Fri Mar 02 16:26:57 EST 2007 | Steve
1- Thickness 0.005" 2- I usually reduce 50% of the thermal pad, but it also depend on original size of thermal pad somehow I have to either create window panel or crosshatch otherwise component wil get wimming during reflow. Hope this will help. Reg
Electronics Forum | Thu Mar 08 18:39:06 EST 2007 | elias67
Stencil Thickness should be .005" A reduction along with cross hatching is a must for the center pad to reduce paste volume as well as to assure even paste deposit while printing on a large pad. With out the cross hatch, the squeegie will most like
Electronics Forum | Wed Jun 17 05:41:04 EDT 2020 | SMTA-Davandran
I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it.
Electronics Forum | Wed Feb 11 08:04:16 EST 2004 | autissier
I'm looking for input from anyone who has experience assembling the LGA package on PCBs. Design, stencil opening, or other requirements are welcoming
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