Electronics Forum | Tue Jan 13 07:44:48 EST 2004 | Chris Cottreau
Upon inspection were seeing most if not all of these SOT 23 are not reflowed properly. The components just sit on top of the solder, this is creating insufficients, poor wetting, etc. There are about 25 SOTS per board, 2 boards per panel creating alo
Electronics Forum | Wed Apr 28 22:35:32 EDT 2004 | davef
We can clean the blank out of LARGE BGA. [Cleaning small BGA is a whoooole nuther issue.] But before we get into that, what's the problem and its breadth? Why are you getting poor wetting? What's the story on the components, board, process materia
Electronics Forum | Thu Jun 23 00:28:42 EDT 2005 | KEN
....how does the part perform in a wetting test. Is it solderable on a bench or dip-plating in a pot? If you add flux and heat can you fix your problem assemblies? If yes, plating finish or substrate is not your problem. What flux are you using?
Electronics Forum | Fri Jul 08 09:14:49 EDT 2005 | Jason Fullerton
I've tested boards with SN100C HAL finish, and wetting to the PCB finish was poor at best, using a no clean SAC305 paste.
Electronics Forum | Tue Feb 07 16:45:32 EST 2006 | Mike
Can someone point out what sort of defects at the joint I can expect if solder is above liquidus for 3-4 minutes rather than the typical 1 - 1.5 minutes. Voids? Grainy joints? Poor wetting? Thanks
Electronics Forum | Wed Mar 01 03:39:10 EST 2006 | dave
Hi Davef, Basically there is very poor signs of wetting ,the hole fill from the top of the board is non-existant and we are using 63/37 solder bars (wave solder machine).
Electronics Forum | Thu Jun 01 05:06:10 EDT 2006 | EC
Hi, I facing some 1005 component with poor wetting and look like not enough solder...... Is there any standard solder paste volume requirement. Appreciate all the input.
Electronics Forum | Fri Aug 04 09:09:22 EDT 2006 | russ
Aj is right, utilize the homeplate aperture, this reduces the amount of paste actually underneath the component, Pb frees exhibit this mid ship more often than the lead, I think,it is mostly because of thre transition to noclean form water solubles
Electronics Forum | Sun Mar 11 19:48:17 EDT 2007 | abjason
There is nothing to argue if you had found Ni above or togather with Gold, definitly you got poor wetness and awful solderbility for sure.
Electronics Forum | Fri Apr 04 01:39:21 EDT 2008 | slthomas
All of what Dave says is spot on. I suspect that the most likely corresponding defects on your assemblies would be poor wetting and insufficient solder.
