Electronics Forum: solder and dipping and profile (Page 9 of 14)

Mix Pb and Pb free alloy

Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM

I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can

Solder Paste and fine pitch components

Electronics Forum | Wed Sep 18 06:53:05 EDT 2002 | CH

1) For solder short, pls check the paste height. Too much vol will cause short. For 15 mils use 5 mils thickness stencil if possible. Check profile preheat time to prevent hot slumpof the paste. 2) type 4 powder will be better for 15 mils pit

Pb alloy reflow temperatures and component integrity

Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra

What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of

BGA crack and strain gauge measurement

Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef

There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 05:26:46 EDT 2019 | ameenullakhan

thanks dave .. I have one more query on the same CCGA. What are the chances of the CCGA lead getting bent or tilt during reflow soldering process. Concern : to achieve the minimum peak temperature of 208 deg C at the connecting leads. On bod

Foam fluxer maintenance, storage and cleaning

Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef

Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept

Working with Lead free and Pb Capacitors

Electronics Forum | Fri Jan 27 17:23:10 EST 2006 | muse95

Watch the solder profiles allowed for these caps. Most electrolytics cannot withstand high heat. Even RoHS compliant Electrolytics are often rated for peak 245C, 3 secs max, for example. Nowhere close to the 260C 10-20 sec you usually like to see.

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Mon Apr 26 09:46:05 EDT 1999 | C.K.

Chrys: I have checked all the basic elements of Wave solder joint formation: fluxing, preheating, and lastly soldering. For checking the fluxer, i used a product from ECD that's very similar to what you desribed called the flux-o-meter. It did a

Weak joint strength and black residue

Electronics Forum | Fri Jun 08 17:22:51 EDT 2007 | naynayno

We have been producing an IMS assembly with SMT dpak's for some time. However, we recently encountered a new problem by chance - the parts can be flicked off with a finger nail. I state by chance because the solder joints are wetted and shiny with

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef

I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does


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