Electronics Forum | Wed May 24 15:28:09 EDT 2000 | John Thorup
Hello Travis I'm going to have to disagree with your evaluation of intrusive reflow. It's not just for low end and,if done correctly, you will not have lots of half soldered leads and touch up will be minimal if at all. I'm sure that others will ag
Electronics Forum | Tue Jan 15 09:42:40 EST 2002 | davef
Here's two choices. 1 Before accepting a lot of boards from your supplier: * Print some paste on a board * Reflow the paste * Inspect the quality of the solder connection * Make a decision on accpting the board based on that observation. 2 Have yo
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis
Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal
Electronics Forum | Tue May 03 20:01:24 EDT 2011 | city4497s
It a recent occurance and it happen randomly on other area. I'm using senju M705-GRN360-KV and Indium SMQ 90 Leadfree solder paste, we have been using both paste for 4~5 years. We have asked the oven supplier to perform maintenance and inspection, pr
Electronics Forum | Wed Jan 14 23:08:19 EST 1998 | Ron Costa
Place your components directly on the PCB without using solder paste,unless your using high temp. solder spheres then you should use paste. If eutectic solder spheres are used try fluxing the BGA area and attach it directly to the board. This will re
Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining
Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure
Electronics Forum | Thu Aug 08 11:58:25 EDT 2013 | rway
I am not that familiar with the older systems. The software should be supported on both old and new alike unless you are limited by the operating system, but the camera will obviously have a lower resolution and perhaps the filtering is not quite as
Electronics Forum | Thu Feb 19 12:56:29 EST 1998 | Earl Moon
| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed proc
Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef
National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun
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