Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon
| We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe
Electronics Forum | Thu Apr 26 11:40:10 EDT 2007 | CL
Good Morning, We have a 3D solder paste inspection machine. We purchased it on a recommendation from a consultant. We are a CM high mix low volume. The President of my company has attended some seminars and meetings where it was conveyed to her that
Electronics Forum | Thu Jun 22 16:59:18 EDT 2000 | Lee
I'll be real brief, because of time, but feel free to contact me later (lgoldberg@chipcenter.com). There is big conceren (somewhat well-founded but a bit overblown) about lead form electronics products leaching into the environment when they are land
Electronics Forum | Thu Apr 26 09:03:35 EDT 2007 | ck_the_flip
3d is good for initial verification that your screen printer and stencil is producing the desired paste height. 2D verification is more than sufficient during regular production. That being said, your best bet for a 3D machine is to go cheap - buy
Electronics Forum | Fri Apr 27 10:33:58 EDT 2007 | ck_the_flip
Jeremy, well said! Thanks for "validating" my theory... LOL I agree that the sampling frequency, AND methodology are key things with 3D inspection. 3D will give you some insight onto how your paste (rheology, viscosity, thixotropy)AND process are
Electronics Forum | Thu Jun 21 22:04:18 EDT 2001 | davef
This is my attempt at beating the "Fuzzburg 7" translator used on the SMTnet Forum that mashes everything it sees. Below the next paragraph are three paragraphs,each with a common numering sequence, where each paragraph represents the columns of a t
Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon
| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec
Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko
Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez
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