Electronics Forum | Fri Jun 06 07:23:18 EDT 2003 | johnw
Hi Kevin, the profile doesn't actually qualify something as lead free or not it's purely the Pb content of the assembly that does this. Currently the understanding of the limitations of the lead in the jont is 0.1% by weight or less. So as long as y
Electronics Forum | Wed Feb 03 23:40:26 EST 1999 | Chris G.
| Does anyone know if I will have problems soldering surface mount components to an all hard gold plated PC board. We want to use hard gold similar to gold used for edge fingers because our customer is concerned about wear and conductivity of connect
Electronics Forum | Fri Apr 07 11:19:55 EDT 2006 | muse95
Technically speaking, most likely yes it will work, unless possibly it is a BGA. There are issues surrounding BGA's. Here are some of the general issues: On any type of component, if the Pbfree solder you are using contains bismuth, then the Pb in
Electronics Forum | Thu Apr 13 02:31:16 EDT 2006 | raqi16
Thank you! sorry, i just realized my posted question was not very specific.. no, it's not a BGA part, it's just a standard surface mount device and the only leaded part are the leads.
Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
Electronics Forum | Mon Sep 18 17:55:55 EDT 2000 | Dave F
Reworking BGA with hot air systems (ie, AirVac, SRT) is fairly complicated and requires fairly rigorous process control. Please compare and contrast BGA rework using hot air and your laser based system.
Electronics Forum | Mon Sep 18 12:04:43 EDT 2000 | Erick Russell
Photonic Soldering is useful for several applications in rework where current methods using hot air are inadequate or inefficient. For high-density assemblies, component clearances are limited. In the past, DFM (Design for Manufacturing) specificati
Electronics Forum | Wed Apr 03 14:16:16 EDT 2019 | davef
My take ... * Just about every BGA in the world is soldered in a reflow oven * A small portion of the BGA are soldered with rework / repair stations * A very small number of BGA are soldered with hot plates, toaster ovens, selective soldering mach
Electronics Forum | Tue Apr 27 12:01:10 EDT 2004 | Dreamsniper
Hi, Can anyone help me as to what is acceptable and reject when it comes to solder balling under BGA's? I've got some BGA's with solder Ball but they seemed to be attached and they are about 10% of the size of the actual soldered BGA joint size. Our
Electronics Forum | Tue Sep 07 16:58:16 EDT 2004 | davef
Au contraire, mon ami. Although there is not "BGA" solderability test specified in J-STD-002A, the Test S can be used to assess solderability on BGA packages. [Joint Soldering Technology Committee ]
