Small SMT Line Pick place machine NeoDen4 without auto Rails+T-962C reflow oven soldering machine+stencil printer PM3040 Please kindly note auto rails and feeders are selectable. Parameters: PM3040:
New Equipment | Rework & Repair Equipment
China TOP 1 led module repairing machine ZM-R720 for P1,P1.2,P1.5,P2 LED soldering and desoldering For more information, contact Rita Li by whatsapp/wechat/viber:0086 134 3448 1030 Skype:ritaleeli Application This machine is used for repairi
New Equipment | Rework & Repair Equipment
We also provide X-ray inspection and X-ray counter for SMT. Contact Rita Li by: whatsapp/wechat:0086 134 3448 1030 skype:ritaleeli Email:ritaleeli0809@gmail.com 2018 top selling mobile phone motherboard chip repairing tools ZM-R6200 optical BGA
New Equipment | Rework & Repair Equipment
We provide SMT inspection and repairing equipment, you are welcome to contact Rita Li by: whatsapp:0086 134 3448 1030 SKype:ritaleeli Email:sales11@zhuomao.com.cn App
New Equipment | Rework & Repair Equipment
X-ray inspection equipment , X ray component counter and BGA rework station, Contact Rita Li for more information by : whatsapp:0086 134 3448 1030 Skype:ritaleeli Email:sales11@zhuomao.com.cn Application This machine is used for repairing the
New Equipment | Rework & Repair Equipment
We provide X-ray inspection and BGA rework solution since year 2005 For more information, contact me by : whatsapp/Wechat:0086 134 3448 1030 Email:sales11@zhuomao.com.cn skype:ritaleeli High precision hot air soldering machine for LED strip li
New Equipment | Rework & Repair Equipment
Seamark top selling optical motherboard BGA chip rework station ZM-R6200 for laptop/mobile PCBA chip soldering and desoldering More information(Rita Li):Whatsapp/Wechat/Viber:0086 134 3448 1030 Skype:Rita Li
Industry Directory | Manufacturer
Vision SMT is professional SMT house.PCBA including BGA,3D AOI inspection, X-ray inspection,selective soldering, in-line coating , testing.
Technical Library | 2012-10-18 21:58:51.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. In this paper, we report on a comprehensive study regarding the morphology evolution and voiding of SnAgCu solder joints on the central pad of two different packages – QFN and an Agilent package called TOPS – on PCBs with a Ni/Au surface finish.
Technical Library | 2012-07-27 11:18:29.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The focus of this paper will quantify the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data showing vo
.gif)
