Electronics Forum: sot-23 (Page 9 of 25)

SMT SOT-23 Part Rotation

Electronics Forum | Fri Feb 04 18:45:26 EST 2022 | chuckphd53

much appreciate the guidance... will be building next week and take a look again at those suggestions.... great info guys :) chuck

Re: SOT23 crack during solder reflow

Electronics Forum | Wed May 26 18:04:16 EDT 1999 | John Thorup

| After reflow proces in convection-IR oven we find broken body of SOT23 elements. There is no problems on other elements (SOIC, chip R,chip C, etc) | Where is the problem? | | Thanks in advance! | Check your profile at the site of cracked component

Re: Wave Soldering Active Components

Electronics Forum | Sun Mar 21 06:27:45 EST 1999 | Bob Willis

| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto

Bottomside SOT23 opens & DOE test board layout

Electronics Forum | Thu May 24 19:19:20 EDT 2001 | davef

Try: * Poor looking solder connections * Good looking solder connections * Reliable solder connections Look to Ch 5 of "Manufacturing Techniques For Surface Mounted Assemblies"; RJ Klein Wassink & MMF Verguld; Electrochemical Pub; ISBN 0-901150-30-4

Re: Machine dropout on SOT23 device

Electronics Forum | Sun Jan 23 09:07:07 EST 2000 | M Cox

Robert 1st Short term, let us know what type of machine you are running. Maybe somebody out here has a trick to get you buy. 2nd Long term, check the pocket dimensions against VS what the manufacturer of the part says it should be. Drive correctiv

Re: Machine dropout on SOT23 device

Electronics Forum | Tue Jan 25 17:01:42 EST 2000 | Robert Steltman

Dave Thanks - have changed to a slightly larger one and it has helped quite a bit, but I feel it is still not perfect. I think I am going to write this one off to a pachaging problem on this one particular device. It is a new machine (2 weeks old) w

Re: Stencil Aperture Reduction Guidelines

Electronics Forum | Fri Dec 17 01:21:54 EST 1999 | Victor Salazar

Weare using a Home plate design on 1210 or larger, 20% reduction on pkgs from 1206 to 1210, 10% reduction on 1206 or smaller, 0 reduction on all leaded components(sot-23, IC's) with a 6 mil stencil. For fine pitch we are using 4mil stencils. We h

Bottom side adhesives

Electronics Forum | Tue Oct 26 11:22:45 EDT 1999 | Morris

I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating th

Bottomside Glued parts

Electronics Forum | Tue Oct 26 11:15:55 EDT 1999 | Morris

I am evaluating a bottom side glueing process. I was wondering if anyone could share their shear force specifications, or how they were developed. I would be most interested in the 0805 and Sot23 package types. Also, does anyone know if heating the

Wave Soldering Active Components

Electronics Forum | Fri Mar 19 18:47:16 EST 1999 | John Gill

Hi Folks, This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the bottom.


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