Electronics Forum | Fri Sep 12 08:01:55 EDT 2008 | davef
There is no standard. On the web, you can find shelf life estimates for various types of solderability protection on bare boards. These estimates won't translate directly to the storage of assembled boards, because assembled boards [and the solderabi
Electronics Forum | Mon May 25 20:17:56 EDT 2009 | paligora
Hi , we have problems with the pick & place nozzle when assembling data switches on the PCB. The SMT switches have top surface with diameter of 2.6mm and our supplier is suggesting that if we need to replace the current nozzle which has oval suction
Electronics Forum | Wed Mar 15 08:47:50 EDT 2017 | emeto
From what I know, you should follow IPC standard for the class assembly that you are building. From your post somebody mentioned something somewhere - doesn't make it official information. I would not be worried about having voids, but what is their
Electronics Forum | Wed Jun 11 16:55:16 EDT 2003 | MA/NY DDave
Hi Yes Thanks, I understand that there are still some arguments going on in the EU and some companies like Phillips AG, I believe, are championing changes. Even so from what I know the combined JEITA/European (Soldertec) /USA NEMI task group is sti
Electronics Forum | Thu Sep 13 22:06:02 EDT 2007 | davef
While you're waiting for others to respond, here's one take on bismuth in lead-free soldering [ http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Articles⊂section=Display&ARTICLE_ID=229915 ] by a long term friend of SMTnet. Find more by sea
Electronics Forum | Fri Jun 06 10:47:27 EDT 2003 | Marc Peo
Kevin, Agree with John's thoughts on profiling and the max temp of 240 degrees in particular. To add to it a bit we have seen the following parameters put in place at many assembly houses to protect against overcooking the components: --Time above
Electronics Forum | Fri Jun 06 07:23:18 EDT 2003 | johnw
Hi Kevin, the profile doesn't actually qualify something as lead free or not it's purely the Pb content of the assembly that does this. Currently the understanding of the limitations of the lead in the jont is 0.1% by weight or less. So as long as y
Electronics Forum | Mon Apr 12 04:56:54 EDT 2004 | qualitel
Hi Eric, Every mounter have a standard count and "release" off the component. The sample and cost saving way is to use the paper (e.g: 4mil,5mil...thick) to measure. Just place on the PCB with supoort base below and release the nozzle step by
Electronics Forum | Wed Sep 24 04:18:12 EDT 2008 | gang
we have some problems in soldering joints such as insufficient solder and misalignment on some RC0402 and CC0402,i don't have a pic here. our SMT enginner doubts the PCB land pattern is at the fault.here is what we measured results.pad length:0.9mm,
Electronics Forum | Tue Aug 17 15:58:14 EDT 2010 | rob_thomas
IPC-7711/7721 states under Scope section: "This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly". This is from Rev B of this standard. There are many factors that play a role in the d
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